Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device

ABSTRACT

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

CROSS REFERENCE OF RELATED APPLICATION

This is a Continuation application that claims the benefit of priorityunder 35U.S.C. § 120 to a non-provisional application, application Ser.No. 15/317,118, filed Dec. 8, 2016, which is a non-provisionalapplication that claims priority to a first Chinese inventionapplication, application number CN 201610091489.7, filed Feb. 18, 2016,a second Chinese invention application, application number CN201610148338.0, filed Mar. 15, 2016, a third Chinese inventionapplication, application number CN 201620200264.6, filed Mar. 15, 2016,and a fourth Chinese invention application, application number CN201610214411.X, filed Apr. 7, 2016, and also claims priority tointernational application number PCT/CN2016/103250, international filingdate Oct. 25, 2016. The afore-mentioned patent applications are herebyincorporated by reference in their entireties.

NOTICE OF COPYRIGHT

A portion of the disclosure of this patent document contains materialwhich is subject to copyright protection. The copyright owner has noobjection to any reproduction by anyone of the patent disclosure, as itappears in the United States Patent and Trademark Office patent files orrecords, but otherwise reserves all copyright rights whatsoever.

BACKGROUND OF THE PRESENT INVENTION Field of Invention

The present invention relates to camera module, and more particularly toan array imaging module and its molded photosensitive assembly, circuitboard assembly and manufacturing method for electronic device.

Description of Related Arts

Nowadays, most of the electronic products incorporate with an integratedcircuit board to provide multiple functions in one single electroniccomponent. In particular, it is noted that this integratedmulti-function crossovers between trends. For example, the mobile phonewhich is originally designed for communication purpose has beendeveloped into a mobile electronic device such as smart phone thatintegrally incorporates with the integrated circuit to provide multiplefunctions of communication, image capturing, Internet-enabled access,navigation, and etc. Therefore, the integrated circuit board mustprovide all-in-one multifunction for the smartphone.

Accordingly, most camera modules in the current mobile electronicdevices are single-lens modules. However, this single-lens camera modulecannot meet the requirements of high image quality and capturingeffectiveness in order to meet the requirement of multi-functionalapplication of the current mobile electronic devices.

An advanced camera module, such as a dual lens camera module, has beenalready used in the current mobile electronic device, wherein the duallens camera module is configured to simulate the human eye structure forimage capturing. In particular, the features and performances of thedual lens camera module, such as 3D capturing and scanning ability,gesture and location recognition, color fidelity (color accuracy orcolor balance), rapid focusing ability, panoramic shooting, backgroundfield of depth, and other aspects, are better than the features andperformances of the single lens camera module. Therefore, there is animportant development direction to include more than one lens cameramodule in the future camera industry. Accordingly, the dual lens cameramodule generally comprises two imaging modules, such that during theimaging capturing process of the dual lens camera module, two images arecaptured by the two imaging modules respectively. Due to the positiondifference between the two imaging modules, the two images will have aspatial position difference. Then, the two images will be processed viaan imaging synthesis method to form a final captured image. It isimportant that the imaging modules must have the uniformity of imagingeffects, such as resolution, shading, color, and the deviation inhorizontal, vertical, and longitudinal directions, wherein theseindications are the major factors to determine the image quality of thedual lens camera module.

However, the current manufacturing and assembling technologies, and thestructure of the dual lens camera module cannot guarantee the imagingquality thereof. As shown in FIG. 1, the existing dual lens cameramodule comprises a circuit board 10P, two lens bases 20P, two imagingmodules 30P, and one supporting frame 40P, wherein a lens motor assembly31P is operatively connected to each of the imaging modules 30P.Accordingly, each of the lens bases 20P is discretely mounted on thecircuit board 10P at one side thereof in order to connect the lens bases20P with each other via the circuit board 10P. The lens motor assembly31P is coupled at and supported by the corresponding lens base 20P. Eachof the lens motor assemblies 31P is enveloped by the supporting frame40P. As shown in FIG. 1B, the two lens bases 20P can be integrated witheach other to form a single base of the dual lens camera moduleaccording to the existing technology. In other words, the lens motorassemblies 31P are mounted at different positions of the lens base 20P.It is appreciated that, through the existing assembling process of theexisting dual lens camera module, each of the lens bases 20P isindividually coupled at the circuit board 10P, such that the dimension,position, etc. . . . of each of the lens bases 20P is hard to control.In other words, the parameters, such as dimension and assemblingposition, of the dual lens camera modules are inconstant. According tothe existing dual lens camera module, as shown in FIG. 1A, the lensbases 20P are individual components and are electrically coupled to thecircuit board 10P in order to connect the lens bases 20P with eachother. Accordingly, the circuit board 10P is a PCB circuit board,wherein the rigidity of the circuit board 10P is relatively weak, suchthat the circuit board 10P is easy to be deformed or bent. As a result,the overall rigidity of the dual lens camera module is hard to controland ensure. After the dual lens camera module is assembled, there willbe a deviation between the two imaging modules 30P during the operationof the dual lens camera module. For example, the distance between thelens motor assemblies 31P cannot be ensured, the positioning toleranceof the lens motor assemblies 31P is relatively large, and the opticalaxis of each of the imaging modules 30P is easily deviated from itsoriginal preset position. Any one of these situations will affect theimage quality of the dual lens camera module. For example, theuncontrollable factors and adverse effects will affect the imagingsynthesis process to form the final captured image. In addition, sincethe lens motor assemblies 31P are wrapped within the supporting frame40P, it is necessary to apply adhesive to a gap between the lens motorassembly 31P and the supporting frame 40P. As a result, the overall sizeof the dual lens camera module will further be relatively increased.

Furthermore, the assembly of the dual lens camera module is based on theconventional COB (Chip On Board) assembling process. The circuit board10P generally comprises a circuit protrusion 11P and a photosensitivechip 12P electrically coupled on the circuit board 10P via a connectingwire such as gold wire 121P. Accordingly, the gold wire 121P has anarc-shape protruded from the board body of the circuit board, such thatthe circuit protrusion 11P and the gold wire 121P protruded from thecircuit board 10P will adversely affect the assembling process of thedual lens camera module.

Since the circuit protrusion 11P and the gold wire 121P are protrudedand exposed from the circuit board 10P, the assembling process will beunavoidably affect by these exposing components. For example, theadhering process of the lens base 20P and the welding process of thelens motor assembly 31P will be affected by the circuit protrusion 11Pand the gold wire 121P. Accordingly, welding resisting agent and dustmay be adhered to the lens base 20P during the welding process of thelens motor assembly 31P. Since the circuit protrusion 11P and thephotosensitive chip 12P are positioned to create a gap therebetween, thedust will be accumulated at the gap thereof. It will contaminate thephotosensitive chip 12P, such that the photosensitive chip 12P willproduce an undesirable result, such as black spots, to affect the imagequality.

Furthermore, the lens base 20P is located at an exterior side of thecircuit protrusion 11P. When the lens base 20P is mounted on the circuitboard 10P, a safety clearance must be provided between the lens base 20Pand the circuit protrusion 11P. In particular, the safety clearanceincludes a horizontal direction and the upward direction of the lensbase 20P with respect to the circuit board 10P. As a result, thethickness of the dual lens camera module will be substantiallyincreased. In other words, it is almost impossible to reduce the overallthickness of the dual lens camera module.

Also, comparing the molding of the dual lens camera module with themolding of the single lens camera module, the coordination of the duallens camera is higher than that of the single lens camera module. Forexample, the optical axes of the imaging modules are required beingcoincident and the optical axes of the lens through the conventional COBprocess must be consistent. Collectively, the overall size of the duallens camera is relatively large, the rigidity of the circuit board isrelatively weak, the flatness of the circuit board is relativelysensitive, and the thickness of the circuit board is relatively large.

SUMMARY OF THE PRESENT INVENTION

The invention is advantageous in that it provides an array imagingmodule and its molded photosensitive assembly, circuit board assemblyand manufacturing method for electronic device, wherein the circuitboard assembly comprises a mold sealer and a circuit member. The moldsealer is sealedly coupled to the circuit member, wherein the moldersealer is correspondingly coupled with a plurality of optical lenses.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein the circuit boardassembly further comprises a circuit board and at least one electronicelement electrically coupled at and protruded out of the circuit board.The electronic element is enclosed within the mold sealer to prevent anexposure of the electronic element.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein since the electronicelement is enclosed within the mold sealer, there is no requirement fora predetermined safety distance between the mold sealer and the circuitboard to minimize the size of the array imaging module. Therefore, thelightness and the thinness of the array imaging module can be achieved.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein since the electronicelement is enclosed within the mold sealer, the electronic elements areisolated to prevent the mutual interference by the adjacent electronicelements.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein since the electronicelement is enclosed within the mold sealer, the distance between twoadjacent electronic elements can be reduced, such that more electronicelements can be electrically coupled at the circuit board with a limitedinstalling area, so as to improve the imaging quality of the arrayimaging module.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein the electronicelement is enclosed within the mold sealer to prevent the electronicelements, especially the metal terminals, from exposing and contactingwith air.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein the moldedphotosensitive assembly comprises a plurality of photosensitive units.The mold sealer is enclosed around an outer periphery of each of thephotosensitive units.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein the mold sealerprovides a plurality of light filtering portions for supporting andcoupling a plurality of light filters, such that no extra supportingframe is required for individually supporting the light filters.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein the circuit boardhas a plurality of inner indention grooves to receive the photosensitiveunits therein to reduce the height difference between the photosensitiveunit and the circuit board. In particular, the photosensitive unit andthe circuit board are aligned at the same planar direction to reduce theheight requirement of the mold sealer.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein the circuit boardcomprises a plurality of conductive channels and a plurality of outerindention grooves correspondingly formed therewith, such that thephotosensitive unit can be coupled at the rear side of the circuit boardvia a Flip Chip (FC) method.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein the circuit boardassembly comprises a reinforcing layer overlapped and connected to thecircuit board to reinforce the strength of the circuit board and toenhance the heat dissipation of the circuit board.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein the circuit boardassembly has a least a reinforcing slot, wherein the mold sealer isextended into the reinforcing slot to enhance the strength of thecircuit board.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein the mold sealerfurther has a lens mounting portion for coupling with the optical lensesso as to retain the optical lenses in position.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein the mold sealer issolidified to integrally bond with the circuit board, such that noadhesive is required for applying on the circuit board. In other words,the circuit board does not have any predetermined adhering area wherethe adhesive is supposedly applied thereon, so as to reduce the size ofthe array imaging module.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein during themanufacturing process of the array imaging module, the adhering step ofapplying the adhesive on the circuit board is omitted to simplify themanufacturing steps of the array imaging module so as to highly increasethe efficiency of the manufacturing process of the array imaging moduleand to substantially reduce the of the manufacturing cost of the arrayimaging module.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein the mold sealer issolidified to integrally bond with the circuit board, such that noadhesive is required for applying on the circuit board. Therefore, noadhesive will flow to the chip coupling portion of the circuit board forcontaminating the optical path of the photosensitive unit, such thatafter the photosensitive unit is coupled at the circuit board, thephotosensitive unit can remain its flatness.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein the mold sealer issolidified to integrally bond with the circuit board, the flatness ofthe circuit board assembly can be enhanced to enhance the imagingquality of the array imaging module.

Another advantage of the invention is to provide an array imaging moduleand its molded photosensitive assembly, circuit board assembly andmanufacturing method for electronic device, wherein the mold sealer isformed as a molded base which has at least a blocking protrusionprotruded from the top side thereof. When the driver or the lens barrelis coupled at the top side of the molded base, the blocking protrusionwill block the adhesive entering into the optical window when theadhesive is applied between the driver and the outer lateral top surfaceof the molded base, for preventing the adhesive contaminating theoptical path of the photosensitive units so as to enhance the imagingquality of the array imaging module.

Additional advantages and features of the invention will become apparentfrom the description which follows, and may be realized by means of theinstrumentalities and combinations particular point out in the appendedclaims.

According to the present invention, the foregoing and other objects andadvantages are attained by a circuit board assembly of an array imagingmodule, which comprises:

a circuit member which comprises a circuit board for electricallyconnecting with at least two photosensitive units of the array imagingmodule; and

a mold sealer sealed and coupled at the circuit board of the circuitmember.

In one embodiment, the mold sealer has at least two optical windows foraligning with the photosensitive units respectively to form at least twolight channels.

In one embodiment, a top side of the mold sealer is a flat surface forsupporting at least one of a supporter, an optical lens, a driver, and alight filter of the array imaging module.

In one embodiment, the mold sealer further has at least two mountinggrooves formed at the top side thereof corresponding to the opticalwindow, wherein the mounting grooves are arranged for engaging with atleast one of the supporter, the optical lens, the driver, and the lightfilter of the array imaging module.

In one embodiment, the mold sealer comprises an enclosing portion, alight filtering portion, and a lens mounting portion, wherein the lightfilter mounting portion and the lens mounting portion integrally andupwardly extended from the enclosing portion to form a step-likeplatform to spacedly support the light filter and the optical lens inposition.

In one embodiment, the light filter mounting portion has two mountingslots located corresponding to the optical window to form a first stepof the step-like platform so as to support the light filter thereat. Thelens mounting portion further has two lens mounting slots locatedcorresponding to the optical window to form a second step of thestep-like platform so as to support the optical lens thereat.

In one embodiment, the lens mounting portion further has two lens innerwalls, wherein each of the lens inner walls is a flat surface to couplewith the optical lens without any threaded structure.

In one embodiment, the circuit member further comprises at least anelectronic element electrically coupled at and protruded from thecircuit board, wherein the electronic element is enclosed within themold sealer for preventing an exposure of the electronic element.

In one embodiment, the electronic element can be a resistor, acapacitor, a diode, a triode, a potentiometer, a relay, a driver, aprocessor, or a combination of above.

In one embodiment, the circuit member further comprises a reinforcinglayer overlapped and connected to the circuit board to reinforce thestrength of the circuit board and to enhance the heat dissipation of thecircuit board.

In one embodiment, the circuit board assembly further comprises ashielding layer that encloses the circuit board and the mold sealer toenhance the strength of the circuit board and to prevent anyelectromagnetic interference of the circuit board assembly.

In one embodiment, the shielding layer can be a metal panel or a metalnet.

In one embodiment, the circuit board assembly has a least a reinforcingslot, wherein the mold sealer is extended into the reinforcing slot toenhance the strength of the circuit board.

In one embodiment, the reinforcing slot is an indention cavity.

In one embodiment, the reinforcing slot is a through slot, such that themold sealer is extended through the circuit board to integrally formwith the circuit board so as to combine the mold sealer with the circuitboard. In addition, the reinforcing slot as the through slot can beeasily formed on the circuit board.

In one embodiment, the circuit board comprises at least two conductivechannels, wherein the photosensitive unit can be coupled at the rearside of the circuit board via a Flip Chip (FC) method.

In one embodiment, each of the conductive channels forms a step-likeplatform for stably supporting the photosensitive unit.

In one embodiment, the material of the circuit board can be selectedfrom a rigid-flex combination board, ceramic substrate, or a rigid PCBboard, or FPC.

In one embodiment, the injection molding material of the mold sealer canbe nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin,or the combination of above.

In one embodiment, the circuit board assembly further comprises at leasttwo motor connecting units, each of the motor connecting units having afirst connecting wire embedded in the mold sealer and electricallyconnected to the circuit board. The first connecting wire has a firstmotor connecting end exposed and extended above the top side of the moldsealer to electrically connect to the motor terminal of the driver.

In one embodiment, the circuit board assembly further comprises at leasttwo motor connecting units, each of the motor connecting units having atleast a connecting wire and a terminal slot. The connecting wire isembedded in the mold sealer and electrically connected to the circuitboard. The first terminal slot of the motor connecting unit is extendedto the top side of the mold sealer. The connecting wire is set at themold sealer and is extended to the bottom wall surface of the terminalslot. The connecting wire comprises a second motor connecting endprovided at the mold sealer and extended to the bottom wall surface ofthe terminal slot, wherein the second motor connecting end iselectrically coupled to the motor terminal of the driver.

In one embodiment, the circuit board assembly further comprises at leasttwo motor connecting units, each of the motor connecting units having atleast a terminal slot and at least a circuit terminal. The circuitterminal is pre-set at the circuit board and electrically connected tothe circuit board. The terminal slot is provided in the mold sealer andis extended from the circuit board to the top side of the mold sealer.The circuit terminal is extended corresponding to the terminal slot forconnecting with the motor terminal of the driver.

In one embodiment, the circuit board assembly further comprises at leasttwo motor connecting units, each of the motor connecting units having atleast an engraving circuit electrically connected to the circuit board,wherein the engraving circuit is embedded in the mold sealer forconnecting with the motor terminal of the driver.

In one embodiment, the engraving circuit is formed by Laser DirectStructuring (LDS) to be embedded in the mold sealer.

In accordance with another aspect of the invention, the presentinvention comprises a manufacturing method of a circuit board assemblyof an array imaging module, which comprises a step of molding a moldsealer on a circuit member.

In one embodiment, the molding step further comprises a step of formingat least two optical windows at the mold sealer.

In one embodiment, the molding step further comprises a step ofenclosing an electronic element electrically coupled at and protrudedout of a circuit board of the circuit member by the mold sealer.

In one embodiment, the molding step further comprises a step of formingat least two mounting grooves formed at the top side of the mold sealerfor engaging with at least one of the supporter, the optical lens, thedriver, and the light filter of the array imaging module.

In one embodiment, the molding step further comprises a step of forminga step-like platform that upwardly extends from an inner side of themold sealer for spacedly support the light filter and the optical lensin position.

In one embodiment, the molding step further comprises a step of forminga threaded structure at an inner wall of the optical window for couplingwith the optical lens with a corresponding threaded configuration.

In one embodiment, the molding step further comprises a step of formingat least a reinforcing slot, which is an indention cavity, at thecircuit board, wherein the mold sealer is extended into the reinforcingslot to enhance the strength of the circuit board.

In one embodiment, the molding step further comprises a step of formingat least a reinforcing slot, which is a through slot, at the circuitboard, wherein the mold sealer is extended into the reinforcing slot toenhance the strength of the circuit board.

In one embodiment, the molding step further comprises a step of formingat least a reinforcing layer overlapped and connected to the circuitboard to reinforce the strength of the circuit board.

In one embodiment, the molding step further comprises a step of forminga shielding layer that encloses the circuit board and the mold sealer toenhance the strength of the circuit board and to prevent anyelectromagnetic interference of the circuit board assembly.

In one embodiment, the molding step further comprises a step ofpre-setting a plurality of connecting wires in the mold sealer andelectrically connected to the circuit board for electrically connectingwith the driver.

In one embodiment, the molding step further comprises a step ofpre-setting a plurality of terminal slots at the top side of the moldsealer for electrically connecting with the motor terminals of thedriver.

In one embodiment, the molding step further comprises a step ofpre-setting a plurality of circuit terminals at the circuit board and aplurality of circuit terminals in the mold sealer and extendedcorresponding to the terminal slots for connecting with the motorterminal of the driver.

In one embodiment, the molding step further comprises a step ofpre-setting a plurality of engraving circuits electrically connected tothe circuit board, wherein the engraving circuits are embedded in themold sealer for connecting with the motor terminal of the driver.

In one embodiment, the engraving circuit is formed by Laser DirectStructuring (LDS) to be embedded in the mold sealer.

In one embodiment, the mold sealer is formed by mold injection orpress-mold to integrally couple with the circuit board.

In accordance with another aspect of the invention, the presentinvention comprises an array imaging module, comprising:

a circuit board assembly, which comprises:

a circuit member for electrically connecting with at least twophotosensitive units; and

a mold sealer sealed and coupled at the circuit member; and

at least two optical lenses; and

at least two photosensitive units electrically connected to the circuitmember, wherein the optical lenses are located along two optical pathsof the photosensitive units respectively.

In one embodiment, the array imaging module further comprises at least asupporter coupled at the circuit board assembly, and at least two lightfilters coupled at the supporter.

In one embodiment, the array imaging module further comprises at leasttwo drivers operatively coupled to the optical lenses respectively andoperatively coupled at the circuit board assembly.

In one embodiment, the array imaging module further comprises at leasttwo light filters operatively coupled at the circuit board assembly.

In accordance with another aspect of the invention, the presentinvention comprises an array imaging module, comprising:

at least two optical lenses; and

a molded photosensitive assembly which comprises:

at least two photosensitive units;

a circuit board, wherein the photosensitive units are electricallycoupled at the circuit board; and

a molded base having at least two optical windows, wherein the moldedbase is integrally coupled at the circuit board at a peripheral portionthereof, wherein the photosensitive units are aligned with the opticalwindows respectively, wherein the optical lenses are located along twooptical paths of the photosensitive units respectively, such that eachof the optical windows forms a light channel through the correspondingphotosensitive unit and the corresponding optical lens.

In one embodiment, the array imaging module further comprises at least alight filter located between each of the photosensitive unit and theoptical lens.

In one embodiment, the light filter is coupled at a top side of themolded base to retain the light filter in position between thephotosensitive unit and the optical lens.

In one embodiment, the light filter is coupled at a lens casing of theoptical lens to retain the light filter in position between thephotosensitive unit and the optical lens.

In one embodiment, the array imaging module further comprises anencircling frame shaped supporter coupled at the top side of the moldedbase, wherein the light filter is coupled at the supporter to retain thelight filter in position between the photosensitive unit and the opticallens.

In one embodiment, the molded base has at least an indented grooveformed at the top side thereof corresponding to the optical window,wherein the light filter is engaged with the indented groove.

In one embodiment, the molded base has at least an indented grooveformed at a surface thereof corresponding to the optical window, whereinthe supporter is engaged with the indented groove.

In one embodiment, the molded photosensitive assembly further comprisesat least a lead wire having two ends electrically connected to a chipconnector of the photosensitive unit and the circuit board of thecircuit board assembly respectively so as to electrically connect thephotosensitive unit with the circuit board.

In one embodiment, the molded photosensitive assembly further comprisesat least an electronic element electrically coupled at and protrudedfrom the circuit board, wherein at least one electronic element isenclosed within the molded base.

In one embodiment, all the electronic elements are enclosed within themolded base.

In one embodiment, the molded base further comprises a base frameoverlapped with and coupled at the circuit board, such that the baseframe will reinforce the strength of the circuit board so as to retainthe flatness of the circuit board.

In one embodiment, the circuit board has at least a first reinforcingcavity, wherein once the molded base is formed, at least a portion ofthe molded base is extended into the first reinforcing cavity tointegrally couple the circuit board and the molded base with each other.

In one embodiment, the base frame has at least a second reinforcingcavity, wherein after the base frame is overlapped with and coupled tothe circuit board, the first reinforcing cavity of the circuit board andthe second reinforcing cavity of the base frame are correspondinglyaligned with each other, such that at least a portion of the molded baseis extended into the first and second reinforcing cavities to integrallycouple the circuit board, the molded base, and the base frame with eachother.

In one embodiment, the base frame further comprises a main base body andat least two conductive bodies which are spacedly and integrallyextended from the main base body. The circuit board further has at leasttwo channels. The circuit board is overlappedly coupled at the main basebody, wherein the two conductive bodies are engaged with the channelsrespectively, such that the photosensitive units are electricallycontacted with the conductive bodies respectively.

In one embodiment, the conductive bodies are protruded from the circuitboard that the photosensitive units are contacted with the conductivebodies respectively.

In one embodiment, the circuit board has at least a receiving chamber,wherein at least one of the photosensitive units is received in thereceiving chamber of the circuit board.

In one embodiment, the number of receiving chamber is lesser than thenumber of photosensitive unit.

In one embodiment, the receiving chamber can be a receiving slot or athrough slot.

In one embodiment, one of the photosensitive units has a largerphotosensitive area while another photosensitive unit has a smallerphotosensitive area.

In one embodiment, the circuit board has at least a receiving chamber,wherein the photosensitive unit having a smaller photosensitive area isreceived in the receiving chamber while the photosensitive unit having alarger photosensitive area is coupled at the surface of the circuitboard.

In one embodiment, the array imaging module further comprises at leasttwo drivers operatively coupled at the optical lenses respectively,wherein the drivers are coupled at the molded base to ensure the opticallenses to be located along the optical paths of the photosensitive unitsrespectively.

In one embodiment, the array imaging module further comprises at leasttwo lens barrels coupled with the optical lenses respectively, whereinat least one of the lens barrels is coupled at the top side of themolded base and at least one of the lens barrels is integrally extendedfrom the top side of the molded base to ensure the optical lenses to belocated along the optical paths of the photosensitive unitsrespectively.

In one embodiment, the array imaging module further comprises at leastone driver and at least one lens barrel. The optical lenses areoperatively coupled with the driver and the lens barrel respectively.The driver is coupled at the top side of the molded base. The lensbarrel is coupled at the top side of the molded base or is integrallyextended from the top side of the molded base. Therefore, the driver andthe lens barrel ensure the optical lenses to be located along theoptical paths of the photosensitive units respectively.

In one embodiment, the molded base further comprises at least oneblocking protrusion protruded from the top side thereof, wherein theinner lateral top surface and the outer lateral top surface are definedat the blocking protrusion as the partition wall between the innerlateral top surface and the outer lateral top surface. The driver iscoupled at the outer lateral top surface. The blocking protrusion willblock the adhesive entering into the inner lateral top surface when theadhesive is applied between the driver and the outer lateral top surfaceof the molded base.

In one embodiment, the array imaging module further comprises asupporter which has at least two supporting cavities, wherein thedrivers are coupled at the supporting cavities of the supporterrespectively.

In one embodiment, a filler is filled between an outer casing of thedriver and an inner wall of the supporter.

In one embodiment, the filler is adhesive.

In accordance with another aspect of the invention, the presentinvention comprises an electronic device, such as a portable electronicdevice, comprising:

an electronic device body; and

at least an array imaging module mounted in the device body for imagecapturing, wherein the array imaging module comprises:

at least two optical lenses; and

a molded photosensitive assembly which comprises:

at least two photosensitive units;

a circuit board, wherein the at least two photosensitive units areelectrically coupled at the circuit board; and

a molded base having at least two optical windows, wherein the moldedbase is integrally coupled at the circuit board at a peripheral portionthereof, wherein the photosensitive units are aligned with the opticalwindows respectively, wherein the optical lenses are located along twooptical paths of the photosensitive units respectively, such that eachof the optical windows forms a light channel through the correspondingphotosensitive unit and the corresponding optical lens.

In one embodiment, the array imaging module is mounted at the devicebody at a transverse direction thereof, wherein the array imaging moduleis located at one of the corners or at a mid portion of the device body.

In one embodiment, the array imaging module is mounted at the devicebody at a longitudinal direction thereof, wherein array imaging moduleis located at one of the corners or at a mid portion of the device body.

In accordance with another aspect of the invention, the presentinvention comprises a molded photosensitive assembly, which comprises:

at least two photosensitive units;

a circuit board, wherein the photosensitive units are electricallycoupled at the circuit board; and

a molded base having at least two optical windows, wherein the moldedbase is integrally coupled at the circuit board at a peripheral portionthereof, wherein the photosensitive units are aligned with the opticalwindows respectively.

In one embodiment, the molded photosensitive assembly further comprisesat least a lead wire having two ends electrically connected to a chipconnector of the photosensitive unit and the circuit board of thecircuit board assembly respectively so as to electrically connect thephotosensitive unit with the circuit board.

In one embodiment, the circuit board has at least a receiving chamber,wherein the photosensitive unit is received in the receiving chamber ofthe circuit board.

In one embodiment, one of the photosensitive units has a largerphotosensitive area while another photosensitive unit has a smallerphotosensitive area.

In one embodiment, the circuit board has at least a receiving chamber,wherein the photosensitive unit having a smaller photosensitive area isreceived in the receiving chamber while the photosensitive unit having alarger photosensitive area is coupled at the surface of the circuitboard.

In one embodiment, the molded base further comprises a base frameoverlapped with and coupled at the circuit board, such that the baseframe will reinforce the strength of the circuit board so as to retainthe flatness of the circuit board.

In one embodiment, the circuit board has at least a first reinforcingcavity, wherein once the molded base is formed, at least a portion ofthe molded base is extended into the first reinforcing cavity tointegrally couple the circuit board and the molded base with each other.

In one embodiment, the base frame has at least a second reinforcingcavity, wherein after the base frame is overlapped with and coupled tothe circuit board, the first reinforcing cavity of the circuit board andthe second reinforcing cavity of the base frame are correspondinglyaligned with each other, such that at least a portion of the molded baseis extended into the first and second reinforcing cavities to integrallycouple the circuit board, the molded base, and the base frame with eachother.

In one embodiment, the base frame further comprises a main base body andat least two conductive bodies which are spacedly and integrallyextended from the main base body. The circuit board further has at leasttwo channels. The circuit board is overlappedly coupled at the main basebody, wherein the two conductive bodies are engaged with the channelsrespectively, such that the photosensitive units are electricallycontacted with the conductive bodies respectively.

In one embodiment, the conductive bodies are protruded from the circuitboard that the photosensitive units are contacted with the conductivebodies respectively.

In one embodiment, the molded base has an indented groove formed at thetop side thereof.

In one embodiment, the molded base further comprises at least oneblocking protrusion protruded from the top side thereof, wherein theinner lateral top surface and the outer lateral top surface are definedat the blocking protrusion as the partition wall between the innerlateral top surface and the outer lateral top surface.

In accordance with another aspect of the invention, the presentinvention comprises a manufacturing method of a molded photosensitiveassembly, comprising the steps of:

(a) electrically coupling at least an electronic element on a circuitboard;

(b) forming a molded base on the circuit board by a molding process tointegrally couple the molded base with the circuit board and to enclosethe electronic element within the molded base, wherein at least anoptical window is formed at the molded base; and

(c) electrically coupling a photosensitive unit at the circuit board toalign with the optical window.

In one embodiment, before the step (b), the step (c) further comprises astep of electrically coupling the photosensitive unit at the circuitboard before the molded base is formed by the molding process, such thatwhen the molded base is formed, the optical window is formed to alignwith the photosensitive unit.

In one embodiment, the step (b) further comprises the steps of:

(b.1) disposing the circuit board with the electronic element thereon ina mold;

(b.2) operating the mold to couple an upper mold body and a lower moldbody with each other that a mold cavity is formed at a peripheralportion and a center portion of the circuit board between the upper moldbody and the lower mold body; and

(b.3) introducing a mold material in fluid state into the mold cavity,wherein when the mold material is solidified, the molded base with theoptical window is formed.

In one embodiment, before the step (b.2), an enclosing film is providedat a mold engaging surface of the upper mold body, wherein the enclosingfilm is sandwiched between the mold engaging surface of the upper moldand the circuit board.

Still further objects and advantages will become apparent from aconsideration of the ensuing description and drawings.

These and other objectives, features, and advantages of the presentinvention will become apparent from the following detailed description,the accompanying drawings, and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B illustrate a conventional dual lens camera module.

FIG. 2A is a sectional view of an array imaging module and its circuitboard assembly according to a first preferred embodiment of the presentinvention.

FIG. 2B illustrates an alternative mode of the array imaging module andits circuit board assembly according to the above first preferredembodiment of the present invention.

FIG. 3A illustrates a manufacturing process of the array imaging moduleand its circuit board assembly according to the above first preferredembodiment of the present invention.

FIG. 3B illustrates an alternative mode of the manufacturing process ofthe array imaging module and its circuit board assembly according to theabove first preferred embodiment of the present invention.

FIG. 4 is a block diagram illustrating a manufacturing process of thecircuit board assembly according to the above first preferred embodimentof the present invention.

FIGS. 5A, 5B, and 5C illustrate different assembling structures betweenthe molded circuit board assembly and the lens motor according to theabove first preferred embodiment of the present invention.

FIG. 6 illustrates an alternative mode of the array imaging moduleaccording to the above first preferred embodiment of the presentinvention.

FIG. 7 is a sectional view of an array imaging module and its circuitboard assembly according to a second preferred embodiment of the presentinvention.

FIG. 8 is a sectional view of an array imaging module and its circuitboard assembly according to a third preferred embodiment of the presentinvention.

FIG. 9 is a sectional view of an array imaging module and its circuitboard assembly according to a fourth preferred embodiment of the presentinvention.

FIG. 10 is a sectional view of an array imaging module and its circuitboard assembly according to a fifth preferred embodiment of the presentinvention.

FIG. 11 is a sectional view of an array imaging module and its circuitboard assembly according to a sixth preferred embodiment of the presentinvention.

FIG. 12 is a sectional view of an array imaging module and its circuitboard assembly according to a seventh preferred embodiment of thepresent invention.

FIG. 13A is a sectional view of an array imaging module and its circuitboard assembly according to an eighth preferred embodiment of thepresent invention.

FIG. 13B is a sectional view of an array imaging module and its circuitboard assembly according to a ninth preferred embodiment of the presentinvention.

FIG. 14 is a sectional view of an array imaging module and its circuitboard assembly according to a tenth preferred embodiment of the presentinvention.

FIG. 15A illustrates a first step of the manufacturing process of thealternative array imaging module according to a preferred embodiment ofthe present invention.

FIG. 15B illustrates a second step of the manufacturing process of thealternative array imaging module according to the above preferredembodiment of the present invention.

FIG. 15C illustrates a third step of the manufacturing process of thealternative array imaging module according to the above preferredembodiment of the present invention.

FIG. 15D illustrates a fourth step of the manufacturing process of thealternative array imaging module according to the above preferredembodiment of the present invention.

FIG. 15E illustrates a fifth step of the manufacturing process of thealternative array imaging module according to the above preferredembodiment of the present invention.

FIG. 15F illustrates a sixth step of the manufacturing process of thealternative array imaging module according to the above preferredembodiment of the present invention.

FIG. 15G illustrates a seventh step of the manufacturing process of thealternative array imaging module according to the above preferredembodiment of the present invention.

FIG. 15H illustrates an eighth step of the manufacturing process of thealternative array imaging module according to the above preferredembodiment of the present invention.

FIG. 16 is a sectional perspective view of the array imaging moduleaccording to an alternative mode of the preferred embodiment of thepresent invention.

FIG. 17 is a perspective view of the array imaging module according tothe above alternative mode of the preferred embodiment of the presentinvention.

FIG. 18 illustrates a first alternative mode of the array imaging moduleaccording to a first alternative mode of the above preferred embodimentsof the present invention.

FIG. 19 illustrates a second alternative mode of the array imagingmodule according to a second alternative mode of the above preferredembodiments of the present invention.

FIG. 20 illustrates a third alternative mode of the array imaging moduleaccording to a third alternative mode of the above preferred embodimentsof the present invention.

FIG. 21 illustrates a fourth alternative mode of the array imagingmodule according to a fourth alternative mode of the above preferredembodiments of the present invention.

FIG. 22 illustrates a fifth alternative mode of the array imaging moduleaccording to the above preferred embodiments of the present invention.

FIG. 23 illustrates a sixth alternative mode of the array imaging moduleaccording to the above preferred embodiments of the present invention.

FIG. 24 illustrates a seventh alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 25 illustrates an eighth alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 26 illustrates a ninth alternative mode of the array imaging moduleaccording to the above preferred embodiments of the present invention.

FIG. 27 illustrates a tenth alternative mode of the array imaging moduleaccording to the above preferred embodiments of the present invention.

FIG. 28 illustrates an eleventh alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 29 illustrates a twelfth alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 30 illustrates a thirteenth alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 31 illustrates a fourteenth alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 32 illustrates a fifteenth alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 33 illustrates a sixteenth alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 34 illustrates a seventeenth alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 35 illustrates an eighteenth alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 36 illustrates a nineteenth alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 37 illustrates a twentieth alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 38 illustrates a twentieth-first alternative mode of the arrayimaging module according to the above preferred embodiments of thepresent invention.

FIG. 39 is a block diagram of the electronic components of the arrayimaging module according to the above preferred embodiments of thepresent invention.

FIGS. 40A to 40C illustrate different modes of the array imaging moduleincorporating with the electronic device according to the abovepreferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The following description is disclosed to enable any person skilled inthe art to make and use the present invention. Preferred embodiments areprovided in the following description only as examples and modificationswill be apparent to those skilled in the art. The general principlesdefined in the following description would be applied to otherembodiments, alternatives, modifications, equivalents, and applicationswithout departing from the spirit and scope of the present invention.

It is appreciated that the terms “longitudinal”, “transverse”, “upper”,“lower”, “front”, “rear”, “left”, “right”, vertical”, “horizontal”,“top”, “bottom”, “exterior”, and “interior” in the following descriptionrefer to the orientation or positioning relationship in the accompanyingdrawings for easy understanding of the present invention withoutlimiting the actual location or orientation of the present invention.Therefore, the above terms should not be an actual location limitationof the elements of the present invention.

Referring to FIGS. 2A to 4, an array imaging module and its circuitboard assembly according to a first preferred embodiment of the presentinvention is illustrated, wherein the array imaging module is able toincorporate with various electronic devices, such as smartphone, suchthat a user is able to capture an image of an object or person via thearray imaging module. For example, the array imaging module serves as acamera to take a photo, video or other image content. The array imagingmodule can be used in a mobile electronic device, such as, but not limitto, a mobile phone, tablet computer, a music player (MP3/4/5), apersonal digital assisting device, an electronic book device, a laptopcomputer, a digital camera, and the like.

As shown in FIGS. 2A to 4, the array imaging module is embodied as adual lens camera module, wherein the array imaging module comprises acircuit board assembly 220, at least two optical lenses 10, and at leasttwo photosensitive units 21.

It is worth mentioning that in the disclosure of the present invention,two optical lenses 10 are illustrated for the array imaging module as anexample. In other embodiments, two or more optical lenses 10 and two ormore photosensitive units 21, such as three optical lenses 10 and threephotosensitive units 21, are constructed to form the array imagingmodule. The numbers of optical lenses 10 and photosensitive units 21should not be limited in the present invention.

Furthermore, each of the optical lenses 10 is electrically coupled withthe circuit board assembly 220 and is retained and supported at an upperportion of the circuit board assembly 220. In particular, each of theoptical lenses 10 is aligned with an optical path of the correspondingphotosensitive unit 21. Accordingly, the circuit board assembly 220 iscoupled at the electronic device. It is appreciated that one opticallens 10 and one photosensitive unit 21 are constructed to form animaging system for capturing image. The capturing target, such as humanor object, is captured by reflecting the light from the target andpassing the reflected light through the optical lens 10 into theinterior of the array imaging module. Then, the photosensitive unit 21will receive the reflected light along the optical path forphotoelectric conversion. In other words, the photosensitive unit 21will convert light signal into electric signal, wherein the electricsignal is then transmitted to the electronic device by the circuit boardassembly 220, such that the electronic device will generate a capturedimage corresponding to the electric signal.

The circuit board assembly 220 comprises a mold sealer 2201 and acircuit member 2202, wherein the mold sealer 2201 is sealedly coupled tothe circuit member 2202. In one embodiment, circuit member 2202 ismolded in the mold sealer 2201. In particular, the mold sealer 2201 canbe made by Molding On Board (MOB) process to seal and couple with thecircuit member 2202. In other words, the mold sealer 2201 and thecircuit member 2202 are integrally constructed to form an integratedstructure.

The circuit member 2202 comprises a circuit board 22, wherein thephotosensitive unit 21 is electrically coupled at the circuit board 22.The circuit member 2201 and the circuit board 22 are integrally formedwith each other. The mold sealer 2201 has two optical windows 231. Themold sealer 2201 is encirclingly mounted around the photosensitive unit21 at an exterior side thereof. The optical windows 231 are supportedand aligned with the optical lenses 10 and the optical paths of thephotosensitive unit 21. In other words, the photosensitive unit 21 islocated at the circuit board 22 to align with the corresponding theoptical window 231.

In one embodiment, the circuit board 22 is initially coupled to the moldsealer 2201 to form an integrated body. Then, the photosensitive unit 21is coupled to the circuit board 22 in order to electrically connect thephotosensitive unit 21 with the circuit board 22. In another embodiment,the photosensitive unit 21 is initially coupled to the circuit board 22to electrically connect the photosensitive unit 21 with the circuitboard 22. Then, the circuit board 22 is coupled to the mold sealer 2201to form an integrated body.

The mold sealer 2201 comprises a connecting body 22011 and two outerring bodies 22012, wherein the connecting body 22011 is mold-connectedbetween the two outer ring bodies 22012 to spacedly separate the outerring bodies 22012 by the connecting body 22011. Accordingly, each of theouter ring bodies 22012 forms the corresponding optical window 231. Thetwo photosensitive units 21 are located at two lateral sides of theconnecting body 22011 to form the array imaging module. It is worthmentioning that the connecting body 22011 serves as a common body orsharing body that when installing the optical lenses 10, wherein theoptical lenses 10 will take even portions of the connecting body 22011.

It is appreciated that the connecting body 22011 of the mold sealer 2201and each of the outer ring bodies 22012 are integrally formed with thecircuit board 22 by molding process. Each of the outer ring bodies 22012is integrally connected to an outer peripheral edge of the circuit body22. The connecting body 22011 is integrally connected at a centerportion of the circuit board 22. It is appreciated that the centerportion of the circuit board 22 is integrally connected to theconnecting body 22011 to form a reinforcing rib so as to enhance therigidity of the circuit board 22 for prevent the deformation of thecircuit board 22. The outer ring bodies 22012 are integrally connectedto the outer peripheral edge of the circuit body 22 to enhance therigidity of the circuit board 22 along the outer peripheral edgethereof. As a result, the mold sealer 2201 will enhance the rigidity ofthe circuit board 22.

The circuit member 2202 comprises a connecting circuit (not shown inFigure) and at least an electronic element 26. The connecting circuit ispre-formed at the circuit board 22. The electronic element 26 iselectrically connected to the connecting circuit and the photosensitiveunits 21. In other words, the electronic element 26 is electricallyconnected to the photosensitive unit 21 through the connecting circuit.Therefore, the electronic element 26 and the photosensitive unit 21 areincorporated with each other during the photosensitive operation. Theelectronic element 26 can be, but not limit to, a resistor, a capacitor,a diode, a triode, a potentiometer, a relay, a driver, or a processor.

According to the preferred embodiment, the electronic element 26 isconfigured corresponding to the photosensitive unit 21 in order toincorporate with the photosensitive unit 21 for photosensitiveoperation.

It is worth mentioning that the mold sealer 2201 is arranged to envelopand encapsulate the one or more electronic elements 26 therewithin, suchthat the one or more electronic elements 26 are enclosed to prevent fromexposing to the surroundings. In other words, the connection between thephotosensitive unit 21 and the one or more electronic elements 26 willbe enclosed in a closed environment. Unlike the conventional cameramodule, the electronic elements 26 thereof are exposed to outside. Forexample, the dust may accumulate at the electronic elements 26, such asa capacitor, and contaminate the photosensitive unit 21. According tothe preferred embodiment, the one or more electronic elements 26 areprotruded from the circuit board 22 as an example. In one embodiment,the one or more electronic elements 26 are embedded in the interior ofthe circuit board 22 to prevent the one or more electronic elements 26being protruded from the circuit board 22. Person skilled in the artshould understand that the one or more electronic elements 26 can beoutwardly protruded between the two photosensitive units 21, wherein theprotruded electronic elements 26 can be enclosed by the connecting body22011 so as to minimize the installing space for the lens base comparingwith the conventional camera module. In other words, the overall size ofthe array imaging module of the present invention is thus be reduced.

It is worth mentioning that the one or more electronic elements 26 areenclosed by the mold sealer 2201 so as to achieve the advantages ofprotecting the electronic element 26 as well as the respective imagingmodule. Person skilled in the art should understand that it should notbe limited to cover the one or more electronic elements 26 by the moldsealer 2201. In other words, the mold sealer 2201 can be molded directlyon the circuit board 22 to embed and encapsulate the one or moreelectronic elements 26 therein in one embodiment, such that the one ormore electronic elements 26 will not protruded from the circuit board22. The mold sealer 2201 can be molded to encircle around the outer sideor surrounding of the electronic element(s) 26.

It is worth mentioning that in one embodiment, the mold sealer 2201 isprotrudedly encircled around the outer side of the photosensitive unit21. In particular, the mold sealer 2201 is sealed at and integrated withthe photosensitive unit 21 to enclose the photosensitive unit 21.Therefore, when the optical lens 10 is mounted at the mold sealer 2201,the photosensitive unit 21 is sealedly enclosed within the mold sealer2201 so as to provide a closed environment for the photosensitive unit21.

As shown in FIGS. 3A to 4, during the manufacturing process of thecircuit board assembly 220, the circuit board 22 can be made by themodification of a conventional circuit board. For example, the circuitboard 22 is treated by a surface molding process. In one embodiment, thecircuit board 22, by means of such as an injection molding machine, ismolded and treated by insert molding that integrally encapsulates thecircuit board 22 after it is treated by the Surface Mount Technology(SMT). For example, molding encapsulation, the circuit board 22 ismolded, such as plastic packaged, to form the mold sealer 2201, or thatthe circuit board 22 is press-molded, which is frequently applied in thesemiconductor encapsulation, to form the mold sealer 2201. Furthermore,the photosensitive unit 21 is then coupled to the circuit board 22 andis electrically connected to the circuit board 22 via a gold wire as anexample. For example, the circuit board 22 can be, but not limit to, arigid-flex combination board, ceramic substrate (non-flexible board), ora rigid PCB board (non-flexible board). The mold sealer 2201 can betreated by, but not limit to, an injection molding process, a moldingprocess, or the like. For example, the injection molding material can benylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, orthe like. The press-molding process can be carried out by using epoxyresin as an example. It is appreciated that the manufacturing methodsand materials can be selected according to the need of the presentinvention and should not be limited in the present invention.

In another embodiment, the manufacturing process of the circuit boardassembly 220 comprises the steps of firstly treating the circuit board22 by SMT process, coupling the photosensitive unit 21 on the circuitboard 22, electrically connecting the photosensitive unit 21 with thecircuit board 22 via connecting wires such as the gold wire, and moldingthe circuit board 22, such as mold-packaging, to form the mold sealer2201 via the insert-molding. Alternatively, the circuit board 22 can bepress-molded to form the mold sealer 2201. It is appreciated that themanufacturing sequence of the circuit board assembly 220 can bealternated and it should not be limited in the present invention.

It is worth mentioning that each of the optical lenses 10 is mounted atthe mold sealer 2201 of the circuit board assembly 220, wherein the moldsealer 2201 itself also serves as a conventional supporting frame, suchthat the mold sealer 2201 supports and retains the optical lens 10 inposition. However, the assembling process is totally different from theconventional COB process, wherein the conventional COB process is thatan independent supporting frame of the camera module is adhered to thecircuit board wherein the supporting frame must have a desired thicknessto form a rigid body to support the optical lens and lens barrel andreserve a safety distance around electronic elements on the circuitboard while it is adhered on top of the electronic elements. In view ofthe present invention, the mold sealer 2201 is molded to the circuitboard 22, via Molding On Board (MOB) process as an example, to retainand affixed on the circuit board 22 in position to form an integralbody. In other words, there is no adhering process in the presentinvention since the molding process of the present invention has betterconnection stability and higher controllability comparing with theconvention COB process. More importantly, there is no requirement for apredetermined safety distance between the mold sealer 2201 and thecircuit board 22 to seal the one or more electronic elements 26. As aresult, the thickness of the array imaging module of the presentinvention can be reduced because the mold sealer 2201 having its desiredthickness directly encloses and encapsulates the one or more electronicelements 26 therein. In addition, the mold sealer 2201 is coated on theone or more electronic elements 26, such that the one or more electronicelements 26 can be overlapped with each other. In other words, there isno such safety distance required around the circuit components in theconventional camera module. Therefore, the mold sealer 2201 not onlyprovides a supportive ability but also has a height fitting into arelatively small and compact area in order to reduce the thickness ofthe array imaging module of the present invention. In addition, the moldsealer 2201 can replace the conventional supporting frame to prevent thetilting error via the adhering process, so as to reduce the accumulativetolerance of the array imaging module during the assembling process.

It is worth mentioning that the shape of the mold sealer 2201 can beselectively adjusted. For example, the electronic element 26 is extendedinwardly to define a protruding portion, such that the width of the moldsealer 2201 will be correspondingly increased. When there is noelectronic element 26, the mold sealer 2201 can be integrally extendedto have a regular shape and to have a reduced thickness. It isappreciated that the shape of the mold sealer 2201 should not be limitedin the present invention.

Furthermore, the mold sealer 2201 comprises an enclosing portion 22013and a light filtering portion 22014. The light filtering portion 22014is molded to integrally extend from the enclosing portion 22013 via themolding process. The enclosing portion 22013 is molded to connect to thecircuit board 22 to enclose the one or more electronic elements 26. Twolight filters 40 are installed at the light filtering portion 22014,wherein the light filter 40 can be, but not limit to, an infraredcut-off filter (IRCF).

In other words, during the assembling process of the circuit boardassembly 220 of the array imaging module, each of the light filters 40is mounted at the light filtering portion 22014, such that the lightfilter 40 is retained in position align with the photosensitive path ofthe corresponding photosensitive unit 21, so as to eliminate anysupporting structure for the light filter 40. In other words, the moldsealer 2201 has the supportive ability as the conventional supportingframe. Taking the advantage of the molding process, the top side of thelight filtering portion 22014 can be molded to have a flat surfacethrough the molding process, such that the light filter 40 can beflatnessly and stably installed at the light filtering portion 22014,which is superior to the conventional camera module.

Furthermore, the light filtering portion 22014 has at least a mountinggroove 220141. In one embodiment, two mounting grooves 220141 arespacedly formed at the light filtering portion 22014, wherein the twomounting grooves 220141 are located corresponding to the optical window231. The mounting grooves 220141 provide a mounting space, wherein aperipheral edge of the light filter 40 is engaged with the respectivemounting groove 220141, such that the light filter 40 will not protrudedout of the top side of the light filtering portion 22014. Preferably,the mounting grooves 220141 are formed at two sides of the mold sealer2201, wherein the light filter 40 can be stably mounted at the moldsealer 2201 to prevent the light filter 40 being protruded out of thetop side of the mold sealer 2201.

It is worth mentioning that the mounting grooves 220141 are configuredto couple with the light filter 40 in one embodiment. In anotherembodiment, the mounting grooves 220141 are configured to couple thecomponent like the motor or optical lens of the array imaging module. Itis appreciated that the use of the mounting groove 220141 should not belimited in the present invention.

According to the preferred embodiment, the photosensitive unit 21 iselectrically connected to the circuit board 22 via at least a lead wire24 which is connected with the circuit board 22. The lead wire 24 canbe, but limited to, gold wire, copper wire, aluminum wire, or silverwire. In particular, the lead wire 24 from the photosensitive unit 21 isconnected to the circuit board 22 via the conventional COB process, suchas welding. In other words, the connection between the photosensitiveunit 21 and the circuit board 22 can be an existing connection techniqueto reduce the cost of the process, to make full use of the conventionalprocess and equipment, and to prevent any waste of the resources. Inaddition, the wiring direction of the lead wire 24 should not belimited. For example, the wiring direction of the lead wire 24 can beextended from the photosensitive unit 21 to the circuit board 22 or canbe extended to the photosensitive unit 21 from the circuit board 22. Itis appreciated that the electrical connection between the photosensitiveunit 21 and the circuit board 22 can be formed by other connectionmethods, which should not be restricted in the present invention.

It is worth mentioning that each of the photosensitive units 21 ismounted at the top side of the circuit board 22, wherein the mold sealer2201 is encircled around the photosensitive unit 21 at the outerperipheral edge thereof. During the manufacturing process of the circuitboard assembly 220, the manufacturing sequence can be altered. In oneembodiment, two photosensitive units 21 are firstly coupled on thecircuit board 22. Then, the mold sealer 2201 is coupled on the circuitboard 22 via the molding process along the outer peripheral edges of thephotosensitive units 21 to enclose the one or more electronic elements26 protruded from the circuit board 22. In another embodiment, thecircuit board 22 is molded to form with the mold sealer 2201 so as toenclose the one or more electronic elements 26 protruded from thecircuit board 22. Then, the photosensitive units 21 are coupled on thecircuit board 22, wherein the photosensitive units 21 are located at theinner lateral side of the mold sealer 2201.

According to the preferred embodiment, two optical lenses 10 areconstructed, as an example, to form the array imaging module of thepresent invention. Through the molding process, the two light filters 40and the two optical lenses 10 are assembled in a consistent manner toobtain better optical performance. In another embodiment, more than twooptical lenses 10 can be constructed in the array imaging module.Correspondingly, more than two optical windows 231 are provided at thecircuit board assembly 220. It is appreciated that the number of opticallens 10 should not be restricted in the present invention.

FIG. 6 illustrates another embodiment of the present invention, whereineach of the optical lenses 10 is directly coupled at the mold sealer2201 of the circuit board assembly 220. In other words, the optical lens10 can be a fix-focus lens assembly that the focal length of the opticallens 10 cannot be selectively adjusted. It is appreciated that theoptical lens 10 is directly coupled at the mold sealer 2201 via a casingconnected thereto. Referencing FIG. 2B, the array imaging module of thepresent invention further comprises at least a driver 30, wherein eachof the drivers 30 is coupled at the mold sealer 2201. The optical lens10 is coupled at and driven by the driver 30, such that the optical lens10 can be driven to move by the driver 30 along the optical path of thephotosensitive unit 21 so as to adjust the focal optical of the opticallens 10. In other words, the optical lens 10 can be an auto-focus lensassembly that the focal length of the optical lens 10 can be selectivelyadjusted. For example, the user is able to selectively adjust the focallength of the optical lens 10 for capturing image.

The driver 30 can be any type and should not be limited in the presentinvention, as long as the optical lens 10 can be driven to move by thedriver 30 along the optical path of the photosensitive unit 21. Forexample, the driver 30 can be, but not limit to, a voice coil motor.

It is worth mentioning that the mold sealer 2201 is arranged to supportthe light filter 40, the optical lenses 10, and/or the driver 40, suchthat the mold sealer 2201 has a supportive ability as the conventionalsupporting frame. Through the molding process, the mold sealer 2201 ismolded to have the flatness and consistency. Therefore, the light filter40, the optical lenses 10, and/or the driver 40 can be flatnessly andstably supported by the mold sealer 2201 via the flatness andconsistency thereof. More importantly, the optical paths of thephotosensitive units 21 can be ensured and consistent, which is noteasily achieved by the conventional camera module.

It is worth mentioning that the mold sealer 2201 is integrally formedwith the circuit board 22 via the molding process to enhance therigidity of the circuit board 22. Comparing with the conventional cameramodule through the conventional COB, the thickness of the circuit board22 of the present invention can be further reduced while the rigidity ofthe circuit board 22 is enhanced. On the other hand, the distancebetween the optical lens 10 and the mold sealer 2201 can be reduced tominimize the lateral dimension of the array imaging module of thepresent invention.

Furthermore, as shown in FIG. 3, the circuit board assembly 220 furthercomprises at least two motor connecting units 2203 operatively connectedto the drivers 30 respectively. Each of the drivers 30 comprises atleast a motor terminal 31. Each of the motor connecting units 2203comprises a first connecting wire 22031 electrically connected to thedriver 30 and the circuit board 22. In particular, each of the firstconnecting wires 22031 is electrically connected to the connectingcircuit of the circuit board 22. Each of the first connecting wires22031 is set at the mold sealer 2201 and is extended to the top side ofthe mold sealer 2201. The first connecting wire 22031 has a first motorconnecting end 220311 exposed and extended above the top side of themold sealer 2201 to electrically connect to the motor terminal 31 of thedriver 30. It is worth mentioning that the first motor connecting end220311 of the first connecting wire 22031 can be embedded in the moldsealer 2201. According to the conventional process, the driver iselectrically connected to the circuit board via an individual wire, suchthat the conventional process is relatively complicated. In view of thepresent invention, the first connecting wire 22031 is pre-set at themold sealer 2201 at the time when the mold sealer 2201 is formed bymolding process, such that the pre-forming configuration thereof canreplace the conventional welding process for wire connection. Therefore,the electrical connection of the first connecting wire 22031 will becomemore stable. In particular, the first connecting wire 22031 is embodiedas a conducting wire being embedded in the mold sealer 2201. Forexample, the first motor connecting end 220311 of the first connectingwire 22031 can be electrically connected to the motor terminal 31 of thedriver 30 via the anisotropic conductive adhesive film or by welding.

In other words, before the mold sealer 2201 is formed, the bottom end ofthe first connecting wire 22031 is electrically connected to the circuitboard 22. Then, when the mold sealer 2201 is formed, the portion of thefirst connecting wire 22031 is enclosed by the mold sealer 2201, suchthat the upper end of the first connecting wire 22031 is exposed andextended out of the top side of the mold sealer 2201 in order to formthe first motor connecting end 220311.

It is worth mentioning that the embedded position of the firstconnecting wire 22031 and the position of the first motor connecting end220311 thereof can be selectively adjusted at the mold sealer 2201according to the configuration of the present invention. In oneembodiment, the first motor connecting end 220311 of the firstconnecting wire 22031 is set at an outer circumference of the moldsealer 2201, i.e. the top side of the mold sealer 2201. In anotherembodiment, the first motor connecting end 220311 of the firstconnecting wire 22031 is set at an inner circumference of the moldsealer 2201, i.e. the bottom side of the mounting groove 220141 of themold sealer 2201. Therefore, the driver 30 is able to be installed atdifferent locations. In other words, when the driver 30 is needed to becoupled at the top side of the mold sealer 2201, the first motorconnecting end 220311 of the first connecting wire 22031 is set at theouter circumference of the mold sealer 2201. When the driver 30 isneeded to be coupled at the bottom side of the mold sealer 2201, thefirst motor connecting end 220311 of the first connecting wire 22031 isset at the inner circumference of the mold sealer 2201, which is thebottom side of the mounting groove 220141.

That is to say, during the manufacturing process of the circuit boardassembly 220, the photosensitive unit 21 is initially coupled at thecircuit board 22 and then the mold sealer 2201 is formed and molded onthe circuit board 22 via the MOB process. During the molding process,the first connecting wire 22031 can be embedded in the mold sealer 2201and the first connecting wire 22031 is electrically connected to thecircuit board 22. In addition, the first motor connecting end 220311 ofthe first connecting wire 22031 is exposed and extended out of the topside of the mold sealer 2201 for electrically connecting to the motorterminal 31 of the driver 30. For example, when the circuit boardassembly 220 is installed at the array imaging module, the motorterminal 31 of the driver 30 can be electrically connected to the firstmotor connecting end 220311 of the first connecting wire 22031 bywelding, so as to electrically connect the driver 30 to the circuitboard 22. As a result, the present invention does not require anyindividual connecting wire to connect the driver 30 to the circuit board22 so as to minimize the length of the motor terminal 31 of the driver30.

FIG. 5A illustrates a modification of the motor connection of thepreferred embodiment. Each of the motor connecting units 2203 comprisesat least one first terminal slot 22032 that receives the motor terminal31 of the driver 30. Accordingly, the first terminal slot 22032 isprovided at the mold sealer 2201 at the top side thereof. In otherwords, the first terminal slot 22032 of the motor connecting unit 2203is formed at the top side of the mold sealer 2201. Each of the motorconnecting units 2203 further comprises at least a second connectingwire 22033 that electrically connects to the driver 30 and the circuitboard 22. Accordingly, the second connecting wire 22033 is set at themold sealer 2201 and is extended to the bottom wall surface of the firstterminal slot 22032. The second connecting wire 22033 comprises a secondmotor connecting end 220331 provided at the mold sealer 2201 andextended to the bottom wall surface of the first terminal slot 22032,wherein the second motor connecting end 220331 is electrically coupledto the motor terminal 31 of the driver 30. In one embodiment, the secondmotor connecting end 220331 can be embodied as a welding pad. The secondconnecting wire 22033 is embodied as a conductive wire embedded in themold sealer 2201.

In other words, during the manufacturing process of the circuit boardassembly 220, the photosensitive unit 21 is initially coupled such asattached to the circuit board 22, and then the mold sealer 2201 ismolded and coupled to the circuit board 22 via the MOB process. At thesame time, the first terminal slot 22032, having a predetermined length,is pre-set at the molding process of the mold sealer 2201. In addition,the second connecting wire 22033 is electrically connected to thecircuit board 22 and is electrically connected to the second motorconnecting end 220331 at the bottom wall surface of the first terminalslot 22032. Therefore, the motor terminal 31 of the driver 30 can beeasily connected to the second connecting wire 22033. For example, whenthe circuit board assembly 220 is installed into the array imagingmodule, the motor terminal 31 of the driver 30 can be inserted into thefirst terminal slot 22032 to electrically connect the second motorconnecting end 220331 of the second connecting wire 22033 by welding.Therefore, the driver 30 is electrically connected to the circuit board22. In other words, no individual wire is needed for electricalconnection between the driver 30 and the circuit board 22. In addition,the motor terminal 31 of the driver 30 can be stably connected toprevent any external force exerted thereto. It is worth mentioning thatthe second connecting wire 22033 can be a conductive wire embedded inthe mold sealer 2201.

FIGS. 3B and 5B illustrate another embodiment of the motor connectingunit. Each of the motor connecting units 2203 comprises at least asecond terminal slot 22034 that receives the motor terminal 31 of thedriver 30. Accordingly, the second terminal slot 22034 is provided atthe mold sealer 2201 at the outer lateral side thereof. In other words,the second terminal slot 22034 of the motor connecting unit 2203 isformed at the outer lateral side of the mold sealer 2201. Each of themotor connecting units 2203 further comprises at least a circuitterminal 22035 pre-set at the circuit board 22 and electricallyconnected to the connecting circuit of the circuit board 22. Inaddition, the second terminal slot 22034 is extended from the top sideof the mold sealer 2201 to the circuit board 22. The circuit terminal22035 is extended corresponding to the second terminal slot 22034. Inone embodiment, the motor terminal 31 is inserted into and retained atthe second terminal slot 22034, wherein the motor terminal 31 iselectrically connected to the circuit terminal 22035 by welding so as toelectrically connect the driver 30 to the circuit board 22.

In other words, during the manufacturing process of the circuit boardassembly 220, the circuit terminal 22035 is pre-formed at the circuitboard 22, and the photosensitive unit 21 and the electronic component 26are coupled to the circuit board 22, and then the mold sealer 2201 ismolded and coupled to the circuit board 22 via the MOB process. At thesame time, the second terminal slot 22034, having a predeterminedlength, is pre-set at the molding process of the mold sealer 2201. Thesecond terminal slot 22034 is extended from the circuit terminal 22035.For example, when the circuit board assembly 220 is installed into thearray imaging module, the motor terminal 31 of the driver 30 can beinserted into the second terminal slot 22034 to electrically connect thecircuit terminal 22035 by welding. Therefore, the driver 30 iselectrically connected to the circuit board 22. In addition, the motorterminal 31 of the driver 30 can be stably connected to prevent anyexternal force exerted thereto.

FIG. 5C illustrates another embodiment of the motor connecting unit.Each of the motor connecting units 2203 comprises at least an engravingcircuit 22036 electrically connected to the connecting circuit of thecircuit board 22, the photosensitive unit 21, and the motor, etc. . . .. For example, the engraving circuit 22036 is formed by, but limited to,Laser Direct Structuring (LDS) and then metal-plating in order toprovide at the mold sealer 2201. According to the conventionalconnecting method, the motor is electrically connected to the circuitboard via an individual wire, such that the manufacturing processthereof is relatively complicated. In view of the present invention, theengraving circuit 22036 can replace the conventional welding process forelectrical connection, such that the electrical connection of thepresent invention will be more stable comparing with the conventionalone. In particular, the engraving circuit 22036 is formed by forming anengraving groove at the mold sealer 2201 and metal-plating the engravinggroove.

According to the preferred embodiment, the driver 30 of the arrayimaging module is sealed and is electrically connected via the abovemotor connecting units 2203 and their alternatives. For example, thedriver 30 can be electrically connected as shown in FIGS. 5A, 5B, and5C, via the first terminal slot 22032 and second connecting wire 22033,the second terminal slot 22034, and the circuit terminal 22035. In oneembodiment, as shown in FIG. 2A, the driver 30 is electrically connectedto the circuit board assembly 220 via the welding process. It isappreciated that the electrical connection between the driver 30 and thecircuit board assembly 220 should not be limited.

As shown in FIG. 7, an array imaging module and its circuit boardassembly 220 according to a second embodiment of the present inventionis illustrated. Unlike the above first embodiment, the circuit boardassembly 220 comprises a circuit board 22A, wherein the circuit board22A has two inner indention grooves 224A. The two photosensitive units21 are received at the inner indention grooves 224A respectively. Inother words, since the photosensitive units 21 are received in the innerindention grooves 224A, the photosensitive units 21 will not protrudedout of top side of the circuit board 22A, such that the height of themold sealer 2201 to seal the photosensitive units 21 will besubstantially reduced. Therefore, the height restriction of the moldsealer 2201 will be reduced to seal the photosensitive units 21 so as tominimize the height of the mold sealer 2201.

Furthermore, the photosensitive unit 21 is electrically connected to thecircuit board 22 via the lead wire 24. The lead wire 24 can be, butlimited to, a gold wire, copper wire, aluminum wire, or sliver wire. Inparticular, the photosensitive unit 21 and the lead wire 24 are embeddedin the inner indention groove 224A of the circuit boar 22A. In oneembodiment, during the manufacturing process of the circuit boardassembly 220, the inner indention groove 224A is initially pre-formed atthe circuit board 22A. In other words, the inner indention groove 224Acan be pre-formed at the conventional circuit board in order to receiveand couple to the photosensitive unit 21.

As shown in FIG. 8, an array imaging module and its circuit boardassembly 220 according to a third embodiment of the present invention isillustrated.

Unlike the above embodiment, the circuit board assembly 220 comprises acircuit board 22B, wherein the circuit board 22B has two conductivechannels 225B spacedly formed at a bottom side of the photosensitiveunit 21 to electrically connect to the circuit board 22B at two lateralsides thereof. The photosensitive unit 21 is coupled at a rear side ofthe circuit board 22B, wherein the photosensitive area of thephotosensitive unit 21 faces upward to receive the light emittingthrough the optical lens 10.

In addition, the circuit board 22B comprises two outer indention grooves226B corresponding to the conductive channels 225B respectively, whereinthe two indention grooves 226B serve as a positioning guider for thephotosensitive unit 21. In particular, when the photosensitive unit 21is coupled at the outer indention grooves 226B, the outer side of thephotosensitive unit 21 is aligned and coincided with the outer side ofthe circuit board 22B, such that the outer side of the photosensitiveunit 21 and the outer side of the circuit board 22B are aligned at thesame planar direction so as to ensure the surface flatness of thecircuit board assembly 220.

Accordingly, the conductive channels 225B are embedded as a platform tostably support the photosensitive unit 21 when the photosensitive unit21 is coupled at the circuit board 22B, so as to expose thephotosensitive area of the photosensitive unit 21.

It is worth mentioning that the present invention further provides anassembling method of the chip, which is a Flip Chip (FC) method.According to the preferred, the photosensitive unit 21 is coupled at therear side of the circuit board 22B, wherein the photosensitive unit iscoupled at the front side of the circuit board in the conventionalprocess. In other words, the circuit board 22B is located above thephotosensitive unit 21 and the photosensitive area of the photosensitiveunit 21 is facing upward when the photosensitive unit 21 is coupled atthe rear side of the circuit board 22B. Through this structural andassembling configuration, the photosensitive unit 21 and the mold sealer2201 are correspondingly independent, such that the photosensitive unit21 will not be affect when assembling the photosensitive unit 21 andwhen forming the mold sealer 2201 by the molding process. In addition,the photosensitive unit 21 is embedded in the outer lateral side of thecircuit board 22B to prevent the photosensitive unit 21 from beingprotruded from the inner lateral side of the circuit board 22B, suchthat a relatively space is reserved at the inner lateral side of thecircuit board 22B. As a result, the height of the mold sealer 2201 willnot be limited by the height of the photosensitive unit 21, such thatthe height of the mold sealer 2201 can be further reduced.

It is worth mentioning that the light filter 40 is coupled at the topside of the conductive channels 225B. Therefore, the light filter 40does not need to couple to the mold sealer 2201 so as to reduce the rearfocal length of the array imaging module which will reduce the heightthereof. In particular, the light filter 40 can be the infrared cut-offfilter (IRCF).

As shown in FIG. 9, an array imaging module and its circuit boardassembly 220 according to a fourth embodiment of the present inventionis illustrated.

The circuit board assembly 220 comprises a reinforcing layer 2204Coverlapped and connected to the circuit board 22 to reinforce thestrength of the circuit board 22. In other words, the reinforcing layer2204C is formed at a bottom side of the circuit board 22 correspondingto the area where the photosensitive unit 21 is located. Therefore, thecircuit board 22 can be rigidly support the mold sealer 2201 and thephotosensitive unit 21.

In addition, the reinforcing layer 2204C can be metal layer overlappedand connected to the bottom side of the circuit board 22 to enhance therigidity of the circuit board 22. The reinforcing layer 2204C also hasheat dissipating ability that the reinforcing layer 2204C caneffectively dissipate heat generated from the photosensitive unit 21.

It is worth mentioning that the circuit board 22 can be a Flex PrintCircuit (FPC). Through the rigidities of the reinforcing layer 2204C andthe circuit board 22, the flex print circuit, having a bendable ability,can fulfill the supportive ability of the circuit board assembly 220.Accordingly, the circuit board 22 can be the Print Circuit Board (PCB),the FPC, or FPC (Rigid-Flex PCB). In other words, the reinforcing layer2204C can substantially increase the strength of the circuit board 22and effectively enhance the heat dissipation, so as to reduce thethickness of the circuit board 22. Therefore, the height of the circuitboard assembly will be substantially reduced to minimize the height ofthe array imaging module.

As shown in FIG. 10, an array imaging module and its circuit boardassembly 220 according to a fifth embodiment of the present invention isillustrated.

Unlike the above embodiments, the circuit board 22D has a least areinforcing slot 227D, wherein the mold sealer 2201 is extended into thereinforcing slot 227D to enhance the strength of the circuit board 22D.

The positions of each of the reinforcing slots 227D can be selectivelymodified according to the rigidity of the circuit board 22D. Preferably,the reinforcing slots 227D are symmetrically formed on the circuit board22D. Accordingly, the rigidity of the circuit board 22D can be enhancedby the reinforcing slot 227D to reduce the thickness of the circuitboard 22D, so as to reduce the thickness of the array imaging module andto enhance the heat dissipation of the circuit board assembly 220.

It is worth mentioning that the reinforcing slot 227D is embodied as anindention cavity, wherein the reinforcing slot 227D is not a throughslot, such that when the reinforcing slot 227D is formed on the circuitboard 22D, the reinforcing slot 22D will not extended through thecircuit board 22D. Therefore, the mold sealer 2201 will not be extendedthrough the circuit board 22D and will not be leaked from thereinforcing slot 227D.

As shown in FIG. 11, an array imaging module and its circuit boardassembly 220 according to a sixth embodiment of the present invention isillustrated.

Unlike the above embodiments, the circuit board 22E has a least areinforcing slot 227E, wherein the mold sealer 2201 is extended into thereinforcing slot 227E to enhance the strength of the circuit board 22E.

The positions of each of the reinforcing slots 227E can be selectivelymodified according to the rigidity of the circuit board 22E. Preferably,the reinforcing slots 227E are symmetrically formed on the circuit board22E. Accordingly, the rigidity of the circuit board 22E can be enhancedby the reinforcing slot 227E to reduce the thickness of the circuitboard 22E, so as to reduce the thickness of the array imaging module andto enhance the heat dissipation of the circuit board assembly 220.

It is worth mentioning that the reinforcing slot 227E is a through slot,such that when the reinforcing slot 227E is formed on the circuit board22E, the reinforcing slot 22E will extended through the circuit board22E. The two opposite sides of the circuit board 22E will communicatewith each other through the reinforcing slot 227E. Therefore, the moldsealer 2201 will be extended through the circuit board 22E to integrallyform with the circuit board 22E so as to combine the mold sealer 2201with the circuit board 22E with a composite material structure. Inaddition, the reinforcing slot 227E as the through slot can be easilyformed on the circuit board 22E.

As shown in FIG. 12, an array imaging module and its circuit boardassembly 220 according to a seventh embodiment of the present inventionis illustrated.

Unlike the above embodiments, the mold sealer 2201F has a least anenclosing portion 22013F, a light filter mounting portion 22014F, and alens mounting portion 22015F. The light filter mounting portion 22014Fand the lens mounting portion 22015F are integrally formed with theenclosing portion 22013F in a sequent manner during the molding process,such that the light filter mounting portion 22014F is integrally formedbetween the enclosing portion 22013F and the lens mounting portion22015F. The enclosing portion 22013F is molded and formed to couple withthe circuit board 22 and to enclose the electronic element 26 and thelead wire 24. The light filter mounting portion 22014F is molded andformed to couple with the light filter 40. In other words, during themanufacturing process of the circuit board assembly 220 for the arrayimaging module, the light filter 40 is mounted and supported at thelight filter mounting portion 22014F, such that the light filter 40 isautomatically retained along the optical path of the photosensitive unit21 without incorporating any conventional supporting frame. Therefore,the light filter mounting portion 22014F has a supportive ability. Dueto the molding process, the top side of the light filter mountingportion 22014F can be made to have a flat surface to evenly support thelight filter 40, which is superior than the conventional camera module.The lens mounting portion 22015F is coupled to the optical lens 10. Inother words, during the manufacturing process of the circuit boardassembly 220 for the array imaging module, the optical lens 10 can bemounted and supported at the inner side of the lens mounting portion22015F, so as to stably retain the optical lens 10 in position.

Furthermore, the light filter mounting portion 22014F has two mountingslots 220141F located corresponding to the optical window 231F, whereinthe light filter 40 has enough space to be stably coupled at themounting slots 220141F. The lens mounting portion 22015F has two lensmounting slots 220151F located corresponding to the optical window 231F,wherein the optical lens 10 has enough space to be stably coupled at thelens mounting slots 220151F.

In other words, the light filter mounting portion 22014F and the lensmounting portion 22015F integrally and upwardly extended to form astep-like platform to spacedly support the light filter 40 and theoptical lens 10 in position without any additional supporting frame asin the conventional camera module.

The lens mounting portion 22015F further has two lens inner walls220152F, wherein each of the lens inner walls 220152F has a closedannular shape, such that a lens edge gap is formed between the lensinner walls 220152F. It is worth mentioning that each of the lens innerwalls 220152F is a flat surface to couple with the optical lens 10without any threaded structure, so as to form the fixed focus lensmodule. It is worth mentioning that the optical lens 10 can be coupledat the lens mounting portion 22015F by adhesive.

As shown in FIG. 13A, an array imaging module and its circuit boardassembly 220 according to an eighth embodiment of the present inventionis illustrated. Unlike the above embodiments, the circuit board assembly220 further comprises a shielding layer 2205 that encloses the circuitboard 22 and the mold sealer 2201 to enhance the strength of the circuitboard 22 and to prevent any electromagnetic interference of the circuitboard assembly 220.

As shown in FIG. 13B, an array imaging module and its circuit boardassembly 220 according to a ninth embodiment of the present invention isillustrated. Unlike the above embodiments, the light filter 40 does notmounted at a molding base 23 but is coupled to the optical lens 10 toensure the optical lens 10 to be aligned along the optical path of thephotosensitive unit 21 and to ensure the light filter 40 to be stablysupported between the photosensitive unit 21 and the optical lens 10. Inother words, during the manufacturing process of the circuit boardassembly 220 for the array imaging module, the light filter 40 isinitially coupled to the optical lens 10 and then the optical lens 10 isretained along the optical path of the photosensitive unit 21.

It is worth mentioning that there is one optical lens 10 and one lightfilter 40 as shown in FIG. 13B. It is appreciated that two or more lightfilters 40 can be stacked and coupled to the optical lens 10 or two ormore optical lenses 10 can be stacked and couple to the light filter 40.

As shown in FIG. 14, an array imaging module and its circuit boardassembly 220 according to a tenth embodiment of the present invention isillustrated. Unlike the above embodiments, the array imaging modulefurther comprises a supporter 70 to support the light filter 40, theoptical lens 10, and/or the driver 30. Accordingly, the supporter 70 iscoupled at the mold sealer 2201, wherein the light filter 40 issupported by the supporter 70, the optical lens 10 is supported by thesupporter 70, and the driver 30 is supported by the supporter 70. Theshape of the supporter 70 can be selectively modified. For example, thesupporter 70 forms a protruding platform for supporting the light filter40. The supporter 70 can be a multiple supporter to support two or morelight filters 40 at the same time. Likewise, the supporter 70 can be asingle supporter to support one single light filter 40. According to thepreferred embodiment, the supporter 70 is the multiple supporter. It isappreciated that the shape of the supporter 70 should not be limited inthe present invention.

FIGS. 15A to 15H illustrate another alternative mode of the assemblingprocess of the present invention, wherein the array imaging modulecomprises at least two optical lenses 10′ and a molded photosensitiveassembly 20′. The molded photosensitive unit 20′ comprises at least twophotosensitive units 21′, a circuit board 22′, a molded base 23′, and atleast two sets of lead wire 24′. It is worth mentioning that the moldsealer 2201 as shown in FIGS. 2A to 14 is embodied as the molded base23′ in this embodiment.

Each of the photosensitive units 21′ comprises a chip connector 211′, aphotosensitive area 212′, and a non-photosensitive area 213′, whereinthe photosensitive area 212′ and the non-photosensitive area 213′ areintegrally defined at the same side of the photosensitive units 21′. Inparticular, the photosensitive area 212′ are defined within orsurrounded by the non-photosensitive area 213′. In other words, thephotosensitive area 212′ is defined at a center of thenon-photosensitive area 213′, wherein the non-photosensitive area 213′encircles around the photosensitive area 212′. The chip connector 211′is located at the non-photosensitive area 213′.

Correspondingly, the circuit board 22′ comprises at least two sets ofcircuit connectors 221′, at least two chip coupling areas 222′, and aperipheral area 223′, wherein the chip coupling areas 222′ and theperipheral area 223′ are integrally formed at a position that peripheralarea 223′ is defined at a periphery of each of the chip coupling areas222′. The circuit connectors 221′ are located at the peripheral area223′.

Each of the lead wires 24′ has a chip connecting terminal 241′ and acircuit board connecting terminal 242′, wherein the lead wire 24′ has acurved configuration between the chip connecting terminal 241′ and thecircuit board connecting terminal 242′.

The photosensitive units 21′ are coupled at the chip coupling areas 222′of the circuit board 22′ respectively, wherein the chip connectingterminal 241′ of the lead wire 24 is electrically connected to the chipconnector 211′ of the photosensitive units 21′. The circuit boardconnecting terminal 242′ of the lead wire 24′ is electrically connectedto the circuit connector 221′ of the circuit board 22′. The molded base23′ is integrally coupled at the peripheral area 223′ of the circuitboard 22′ to form the molded photosensitive assembly 20′. The opticallenses 10′ are coupled at the molded photosensitive assembly 20′ alongthe optical paths of the photosensitive units 21′ respectively. When thelight is reflected from the object and passes through the optical lenses10′, the light will enter into the interior of the array imaging moduleto the photosensitive areas 212′ of the photosensitive units 21′. Then,the photosensitive units 21′ will convert the light signal into theelectric signal for obtaining the image of the object through thephotoelectric conversion process.

In one embodiment, each of the chip connector 221′ of the photosensitiveunits 21′ and the circuit connector 221′ of the circuit board 22′ can bea connecting tray. In other words, each of the chip connector 221′ ofthe photosensitive units 21′ and the circuit connector 221′ of thecircuit board 22′ has a tray configuration. Therefore, the chipconnecting terminal 241′ of the lead wire 24 can be easily connected tothe chip connector 211′ of the photosensitive units 21′. The circuitboard connecting terminal 242′ of the lead wire 24′ can be easilyconnected to the circuit connector 221′ of the circuit board 22′. Inanother embodiment, each of the chip connector 221′ of thephotosensitive units 21′ and the circuit connector 221′ of the circuitboard 22′ has a spherical shape, such as applying a paste or otherwelding materials as a connection point at each of thenon-photosensitive area 213′ of the photosensitive units 21′ and theperipheral area 223′ of the circuit board 22′ in order to form each ofthe chip connector 221′ of the photosensitive units 21′ and the circuitconnector 221′ of the circuit board 22′. It is appreciated that theabove examples are illustrative only that each of the chip connector221′ of the photosensitive units 21′ and the circuit connector 221′ ofthe circuit board 22′ can be formed by different ways.

The non-photosensitive area 213′ of the photosensitive units 21′ has achip inner lateral side 2131′, a chip connecting portion 2132′, and achip outer lateral side 2133′. The chip connector 211′ is located at thechip connecting portion 2132′. The chip inner lateral side 2131′ isextended and encircled around the photosensitive area 212′. Two lateralsides of the chip connecting portion 2132′ is extended to the chip innerlateral side 2131′ and the chip outer lateral side 2133′ respectively.In other words, the chip inner lateral side 2131′ is defined between thenon-photosensitive area 213′ where of the chip connector 211′ is locatedand the edge of the photosensitive area 212′. The chip connectingportion 2132′ is defined at the non-photosensitive area 213′ where ofthe chip connector 211′ is located. The chip outer lateral side 2133′ isdefined between the non-photosensitive area 213′ where of the chipconnector 211′ is located and an outer edge of the photosensitive units21′. In other words, at the top view of the photosensitive units 21′,the photosensitive area 212′, the chip inner lateral side 2131′, a chipconnecting portion 2132′, and a chip outer lateral side 2133′ are formedin sequence from an inner side of the photosensitive units 21′ to anouter side thereof.

Correspondingly, the peripheral portion 223′ of the circuit board 22′has a circuit board inner lateral side 2231′, a circuit board connectingportion 2232′, and a circuit board outer lateral side 2233′. The circuitconnector 221′ is coupled at the circuit board connecting portion 2232′.

The circuit board inner lateral side 2231′ is extended and encircledaround the chip coupling area 222′. Two lateral sides of the circuitboard connecting portion 2232′ is extended to the circuit board innerlateral side 2231′ and the circuit board outer lateral side 2233′respectively. In other words, the circuit board inner lateral side 2231′is defined between the peripheral area 223′ where of the circuitconnector 221′ is located and the edge of the chip coupling area 222′.The circuit board connecting portion 2232′ is defined at peripheral area223′ where of the circuit connector 221′ is located. The circuit boardouter lateral side 2233′ is defined between the peripheral area 223′where of the circuit connector 221′ is located and an outer edge of thecircuit board 22′. It is worth mentioning that the circuit board 22′ isa one piece integrated body. Preferably, the chip coupling areas 222′are symmetrically formed at two side ends of the circuit board 22′, suchthat the circuit board 22′ has a symmetrical configuration andstructure.

In addition, the material of the lead wire 24′ should not be limited inthe present invention. For example, the lead wire 24′ can be a goldwire, such that the photosensitive units 21′ can be electricallyconnected to the circuit board 22′ via the gold wire. In addition, thephotosensitive area 212′ of the photosensitive units 21′ is able toconvert light signal into electric signal, wherein the electric signalcan transmit to the circuit board 22′ via the lead wire 24′.Accordingly, the lead wire 24′ can be a sliver wire, copper wire, or thelike in order to transmit the electric signal from the photosensitiveunits 21′ to the circuit board 22′.

The array imaging module of the present invention can be a fixed-focuscamera module, an auto-focus camera module, or zoom camera module. Forexample, the array camera module can have the autofocus and optical zoomability under the controlled height restriction, so as to improve theimaging quality of the array imaging module.

In particular, as shown in FIGS. 15A to 15H, the array imaging modulefurther comprises at least two drivers 30′, wherein the drivers 30′ areoperatively coupled to the optical lenses 10′ respectively. Each of thedrivers 30′ is supported and coupled at the molded base 23′ at the topside thereof to retain the optical lenses 10′ at the photosensitivepaths of the photosensitive units 21′ of the molded photosensitiveassembly 20′ respectively. Each of the drivers 30′ is electricallycoupled to the circuit board 22′, wherein after the circuit board 22′transmits the electric signal to each of the drivers 30′, each of thedrivers 30′ will drive the corresponding optical lens 10′ to move alongthe optical path of the corresponding photosensitive unit 21′ foradjusting the focal point of the array imaging module. In other words,the optical lenses 10′ are driven to move by the drivers 30′respectively.

It is worth mentioning that the driver 30′ can be modified or selectedin different types without any limitation of the array imaging module ofthe present invention. For example, the driver 30′ can be a voice coilmotor for driving the optical lens 10′ along the optical path of thephotosensitive unit 21′, wherein the driver 30′ is able to receive theelectric signal and control signal for operation.

As shown in FIGS. 15A to 15H, the array imaging module further comprisesat least a light filter 40′. In one embodiment, the present inventioncomprises at least a lighter filter 40′, wherein the light filter 40′ iscoupled at the top side of the molded base 23′, such that the lightfilter 40′ can be located at different positions corresponding to theoptical path of the photosensitive unit 21′. In another embodiment, thearray imaging module further comprises two or more light filters 40′,wherein the light filters 40′ are coupled at the top side of the moldedbase 23′, such that the light filters 40′ can be located correspondingto the optical paths of the photosensitive units 21′. In other words,the photosensitive units 21′, the light filters 40′, and the opticallenses 10′ are coupled respectively.

During the operation of the array imaging module, the light is reflectedby the object and is guided to pass through the optical lens 10′ intothe interior of the array imaging module. Then, the light will passthrough the light filter 40′ to the photosensitive unit 21′, such thatthe photosensitive unit 21′ will receive the reflected light along theoptical path for photoelectric conversion. Accordingly, the light filter40′ is arranged for filtering stray light, such as the infrared lightportion, in the light from the optical lens 10′ for improving theimaging quality of the array imaging module.

In addition, the light filter 40′ is directly coupled at the top side ofthe molded base 23′. Alternatively, the light filter 40′ can be coupledat a supporter which is coupled at the top side of the molded base 23′,such that the light filter 40′ is coupled at the top side of the moldedbase 23′ via the supporter. Therefore, the size of the light filter 40′can be reduced to reduce the manufacturing cost of the array imagingmodule.

According to the present invention, the light filter 40′ can be formedin different types for different implements of the array imaging module.For example, the light filter 40′ can be an infrared cut-off filter, afull transmissible spectral filter, other filters, or two or moredifferent light filters 40′. For example, the infrared cut filter andthe full transmissible spectral filter can form a combination of lightfiltering unit, such that the infrared cut filter and the fulltransmissible spectral filter can be selectively switched to locatealong the optical path of the photosensitive unit 21′. For example, theinfrared cut filter is selectively switched to locate along the opticalpath of the photosensitive unit 21′ when the array imaging module isoperated under the day light environment in which the environmentallight is sufficient. Therefore, the infrared light portion of the lightwill be filtered by the infrared cut filter when entering into theinterior of the array imaging module. Likewise, the full transmissiblespectral filter is selectively switched to locate along the optical pathof the photosensitive unit 21′ when the array imaging module is operatedunder the dark environment in which the environmental light isinsufficient. Therefore, the infrared light portion of the light willnot be filtered by the infrared cut filter when entering into theinterior of the array imaging module.

During the manufacturing process of the array imaging module, as shownin FIG. 15A, at least one set of the electronic elements 26′ of themolded photosensitive assembly 20′ is treated by Surface MountTechnology (SMT) to electrically couple at the peripheral portion 223′of the circuit board 22′. In particular, each of the electronic elements26′ is electrically coupled at the peripheral portion 223′ of thecircuit board 22′ at the circuit board outer lateral side 2233′ thereof.It is worth mentioning that the one or more electronic elements 26′ canalso be electrically coupled at the center portion of the circuit board22′ according to the need of the electronic elements 26′. In particular,none of the electronic element 26′ is electrically coupled at the chipcoupling area 222′ of the circuit board 22′.

As shown in FIG. 15B, the electronic element 226′ at the circuit board22′ is disposed in a mold 100′, wherein the molded base 23′ is formed inthe mold 100′ by means of the molding technology. In particular, themold 100′ comprises an upper mold body 101′ and a lower mold body 102′,wherein at least one of the upper mold body 101′ and the lower mold body102′ is movable and operable for mold closing and drafting in acontrolling manner. When the upper mold body 101′ and the lower moldbody 102′ are coupled with each other to form a close mold, a moldcavity 103′ is formed therewithin, wherein the peripheral portion 223′of the circuit board 22′ and the center portion of the circuit board 22′are correspondingly disposed in the mold cavity 103′. Preferably, theelectronic elements 226′ provided on the circuit board 22′ are generallydisposed in the mold cavity 103′.

Referring to FIG. 15C, a mold material is heated to fluid state andintroduced or injected in the mold cavity 103′ to fill the mold cavity103′ and enclose each of the electronic elements 26′, so that when themold material is solidified in the mold cavity 103′, the molded base 23′integrated with the circuit board 22′ and the electronic elements 26′ isformed. Referring to FIG. 15D, the molded base 23′ not only encloseseach of the electronic elements 26′ to prevent each of the electronicelements 26′ from exposing and contacting with air outside, but alsoisolate the electronic elements 26′ with each other to prevent themutual interference by the adjacent electronic elements 26′.Accordingly, it is appreciated that the distance between every twoadjacent electronic elements 26′ can be reduced, such that moreelectronic elements 26′ can be electrically coupled at the circuit board22′ with a limited installing area, so as to improve the imaging qualityof the array imaging module.

It is worth mentioning that the mold 100′ further comprises an enclosingfilm 104′ provided at a mold engaging surface 1011′ of the upper moldbody 101′, wherein when the upper mold body 101′ and the lower mold body102′ are coupled with each other in a mold closing state, the moldengaging surface 1011′ of the upper mold body 101′ will not directlycontact with the circuit board 22′. Therefore, the enclosing film 104′will provide a buffering effect at the mold engaging surface 1011′ ofthe upper mold body 101′ to prevent the circuit board 22′ from beingdirectly impact when the upper mold body 101′ and the lower mold body102′ are closed and coupled with each other, so as to prevent thedeformation of the circuit board 22′. In addition, the enclosing film104′ further provides a sealing effect between the mold engaging surface1011′ of the upper mold 101′ and the circuit board 22′ to ensure asealing therebetween. In other words, during the molding process, thesealing engagement of the enclosing film 104′ will prevent the fluidstate mold material flowing to the chip coupling portion 222′ of circuitboard 22′ from the mold cavity 103′, so as to ensure the flatness of thechip coupling portion 222′ of circuit board 22′. Furthermore, after themold material is solidified to form the molded base 23′, the enclosingfilm 104′ also facilitates the mold drafting process, wherein after theupper mold body 101′ is separated from lower mold body 102′ and removedfrom the circuit board 22′ via the enclosing film 104′, an integral bodyof the molded base 23′, the circuit board 22′ and the electronicelements 26′ are formed as shown in FIG. 15E. It is worth mentioningthat the chip coupling portion 222′ of the circuit board 22′ is locatedwith respect to the optical window 231′ of the molded base 23′, suchthat the optical lens 10′ and the photosensitive unit 21′ can be coupledat the optical window 231′ thereafter to form a light channel.

In addition, the top side of the molded base 23′ has an inner lateraltop surface 232′ and an outer lateral top surface 233′, wherein thelight filter 40′ is coupled at the inner lateral top surface 232′ andthe driver 30′ is coupled at the outer lateral top surface 233′.Preferably, the inner lateral top surface 232′ of the molded base 23′ islocated below the outer lateral top surface 233′ thereof, such that dueto the height difference, the inner lateral top surface 232′ and theouter lateral top surface 233′ form a step-ladder configuration. Inother words, the molded base 23′ further has an indention slot 234′,wherein the light filter 40′ is coupled at the inner lateral top surface232′ within the indention slot 234′, so as to reduce the height of thearray imaging module.

Furthermore, the molded base 23′ further comprises a blocking protrusion235′ protruded from the top side thereof, wherein the inner lateral topsurface 232′ and the outer lateral top surface 233′ are defined at theblocking protrusion 235′ as the partition wall between the inner lateraltop surface 232′ and the outer lateral top surface 233′. When the driver30′ is assembled, the blocking protrusion 235′ will protect thephotosensitive path of the photosensitive unit 21′ by blocking the lightray and the contaminant entering into the photosensitive path of thephotosensitive unit 21′.

As shown in FIG. 15F, the photosensitive units 21′ are coupled at thechip coupling portions 222′ of the circuit board 22′ respectively andare electrically coupled to the circuit board 22′ via the lead wires24′. Therefore, the molded photosensitive assembly 20′ is formed,wherein the photosensitive units 21′ are located at the optical windows231′ respectively.

As shown in FIG. 15G, the light filters 40′ are installed at the innerlateral top surface 232′ of the molded base 23′ in sequence, such thatthe light filters 40′ are retained and located along the photosensitivepath of the photosensitive unit 21′. Preferably, after the light filters40′ are installed at the molded base 23′, the optical windows 231′ ofthe molded base 23′ are sealed by the light filters 40′ respectively.

As shown in FIG. 15H, the optical lenses 10′ are coupled to the drivers30′ respectively, wherein the drivers 30′ are installed at the outerlateral top surface 234′ of the molded base 23′ via adhesive or othermounting methods, such that the optical lenses 10′ are located along thephotosensitive path of the photosensitive units 21′ respectively to formthe array imaging module.

It is worth mentioning that during the assembling of the driver 30′ atthe top side of the molded base 23′, the blocking protrusion 235′substantially blocks the adhesive applied between the driver 30′ and theouter lateral top surface 234′ of the molded base 23′ from entering intothe optical window 231′, for preventing any adhesive contaminating thephotosensitive path of the photosensitive units 21′ so as to enhance theimaging quality of the array imaging module.

FIGS. 16 and 17 illustrate an alternative mode of the array imagingmodule, wherein the array imaging module further comprises a supporter50′ which has at least two supporting cavities 51′. The two supportingcavities 51′ are located at two lateral sides of the supporter 50′, suchthat each of the supporting cavities 51′ forms a channel. The drivers30′ are coupled at the supporting cavities 51′ of the supporter 50′respectively, such that each of the drivers 30′ is stably retained inposition for ensuring the optical lens 10′ to be coaxially aligned withthe driver 30 and for increasing the strength of the array imagingmodule, so as to enhance the imaging quality of the array imagingmodule.

Preferably, after the drivers 30′ are coupled at the supporting cavities51′ of the supporter 50′ respectively, a filler is filled between anouter casing of the driver 30′ and an inner wall of the supporter 50′ toensure the drivers 30′ to be stably coupled at the supporter 50′ so asto prevent any unwanted wobbling movement of the driver 30. Preferably,the filler can be adhesive filled between the an outer casing of each ofthe drivers 30′ and an inner wall of the supporter 50′.

FIGS. 15A to 17 illustrates the array imaging module as a dual lenscamera module. As shown in FIG. 18, the array imaging module can beformed as a multiple lens camera module having multiple optical lenses10′.

FIG. 19 illustrates another alternative mode of the array imagingmodule, wherein the array imaging module comprises two circuit boards22′, wherein each of the circuit boards 22′ has a chip coupling portion222′ and a peripheral portion 223′. The photosensitive units 21′ areelectrically coupled at the chip coupling portions 222′ of the circuitboards 22′ respectively. During the mold process to form the molded base23′, the molded base 23′ comprises a main mold body 232′ coupled at theperipheral portion 223′ of each of the circuit boards 22′. In otherwords, the circuit boards 22′ can be a split type circuit board.

FIG. 20 illustrates another alternative mode of the array imagingmodule, wherein the array imaging module comprises a lens barrel 60′ andat least a driver 30′. The lens barrel 60′ is integrally extended fromthe top side of the molded base 23′, wherein the driver 30 is coupled atthe top side of the molded base 23′, such that the lens barrel 60′ andthe molded base 23′ are respectively assembled with the optical lens10′. Preferably, the lens barrel 60′ and the molded base 23′ are formedintegrally during the mold process. For example, the array imagingmodule is a dual lens camera module which incorporates with one driver30′ and one lens barrel 60′.

FIG. 21 illustrates another alternative mode of the array imagingmodule, wherein the array imaging module comprises a lens barrel 60′ andat least a driver 30′. The lens barrel 60′ and the driver 30′ arecoupled at the top side of the molded base 23′, wherein the opticallenses 10′ are coupled at the lens barrel 60′ and the driver 30′respectively to ensure the optical lenses 10′ to be aligned with thephotosensitive path of the photosensitive unit 21′. It is worthmentioning that the lens barrel 60′ has a thread-less structure as shownin FIG. 21. It is appreciated that the lens barrel 60′ can have athreaded structure, such that the lens barrel 60′ and the optical lens10′ can be coupled with each other via the threaded structure so as tosecurely couple the optical lens 10′ at the lens barrel 60′.

FIG. 22 illustrates a fifth alternative mode of the array imagingmodule, wherein the array imaging module comprises two lens barrels 60′mounted to the top side of the molded base 23′. The optical lenses 10′are coupled at the lens barrels 60′ respectively. Preferably, the lensbarrels 60′ are respectively coupled to the molded base 23′ in anintegrated manner during the mold process.

FIG. 23 illustrates a sixth alternative mode of the array imagingmodule, wherein the array imaging module comprises two lens barrels 60′.After the molded photosensitive assembly 20′ is formed, the lens barrels60′ are coupled at the top side of the molded base 23′ at differentpositions. In other words, the optical lenses 10′ are coupled at thelens barrels 60′ respectively, such that the optical lenses 10′ arelocated along the optical paths of the photosensitive units 21′respectively. It is worth mentioning that the lens barrel 60′ can havethe threaded structure or the thread-less structure, wherein themounting structure of the lens barrel 60′ should not be restricted.

FIGS. 22 and 23 illustrate two different alternative modes of the arrayimaging module. FIG. 24 illustrates a seventh alternative mode of thearray imaging module, wherein the array imaging module comprises atleast a lens barrel 60′ integrally extended from the top side of themolded base 23′ during the mold process. Another lens barrel 60′ iscoupled at the top side of the molded base 23′. For example, when thearray imaging module is embodied as the dual lens camera module, one ofthe lens barrel 60′ is integrally extended from the top side of themolded base 23′ during the mold process and another lens barrel 60′ iscoupled at the top side of the molded base 23′ for auto-focusing.

FIG. 24 illustrates an eighth alternative mode of the array imagingmodule, wherein the array imaging module comprises a circuit board 22′having at least a receiving chamber 228′, wherein the photosensitiveunit 21′ is received in the receiving chamber 228′ of the circuit board22′ to minimize the height difference between the top side of thephotosensitive unit 21′ and the top side of the circuit board 22′.Preferably, the top side of the photosensitive unit 21′ and the top sideof the circuit board 22′ are aligned with the same planar direction.Therefore, the height of the array imaging module can be furtherreduced. The array imaging module can be incorporated with the thinnessof the electronic device. It is worth mentioning that the receivingchamber 228′ can be a receiving slot. FIG. 26 illustrates a ninthalternative mode of the array imaging module, wherein the receivingchamber 228′ can be a receiving through hole for reducing the height ofthe array imaging module.

FIG. 27 illustrates a tenth alternative mode of the array imagingmodule, wherein the array imaging module comprises a circuit board 22′having at least a receiving chamber 228′, wherein the number ofreceiving chamber 228′ is lesser than the number of photosensitive unit21′. For example, the circuit board 22′ has one receiving chamber 228′,wherein one of the photosensitive units 21′ is coupled on the top sideof the circuit board 22′ and another photosensitive unit 21′ is disposedin the receiving chamber 228′, such that the two photosensitive units21′ are retained at the same planar level, so as to enable the differentfocus ranges of two images from the array imaging module.

It is worth mentioning that the receiving chamber 228′ can be a throughhole as shown in FIG. 27. It is appreciated that the receiving chamber228′ can be an indented slot.

FIG. 28 illustrates an eleventh alternative mode of the array imagingmodule. The size of each of the photosensitive unit 21′ and the size ofeach of the optical lens 10′ are different. For example, one of thephotosensitive units 21′ is larger than another photosensitive unit 21′.The larger photosensitive unit 21′ is incorporated with one of theoptical lenses 10′ which is a wide-angle optical lens. The smallerphotosensitive unit 21′ is incorporated with the optical lens 10′ whichis a long-range focus optical lens. Therefore, the array imaging modulewill have an enhanced imaging quality.

FIG. 29 illustrates a twelve alternative mode of the array imagingmodule. The larger photosensitive unit 21′ is coupled at the outer sideof the circuit board 22′ and the smaller photosensitive unit 21′ isdisposed in the receiving chamber 228′ of the circuit board 22′, suchthat the photosensitive units 21′ can be incorporated with the opticallens with extra long range focus optical lens so as to enhance thefocusing power of the array imaging module.

FIG. 30 illustrates a thirteenth alternative mode of the array imagingmodule, which comprises a light filter 40′ coupled at the molded base23′ After the optical lenses 10′ are retained along the optical paths ofthe photosensitive units 21′ respectively, the light filters 40′ arecoupled to the optical lenses 10′ at different positions respectively.Therefore, the light can be filtered by the light filters 40 and canpass through the optical lenses 10′ respectively, such that thephotosensitive units 21′ will receives two lights from the opticallenses 10 for photoelectric conversion.

FIG. 31 illustrates a fourteenth alternative mode of the array imagingmodule, which comprises at least a supporter 70′. Accordingly, thenumber of supporter 70′ matches with the numbers of light filter 40′ andoptical lens 10′. The light filters 40′ are installed at the supporters70′ respectively, and the supporters 70′ are installed at the moldedbase 23′. The light filters 40′ are located along the photosensitivepaths of the photosensitive units 21′. Therefore, the size of the lightfilter 40′ can be reduced so as to minimize the manufacturing cost ofthe array imaging module.

FIG. 32 illustrates a fifteenth alternative mode of the array imagingmodule, which comprises at least a supporter 70′, wherein the lightfilter 40′ is installed at the supporter 70′. The supporter 70′ isinstalled at the molded base 23′, wherein the optical lenses 10′ arelocated along the photosensitive paths of the photosensitive units 21′.Therefore, the optical lenses 10 can be correspondingly retained atdifferent locations of the light filters 40′.

FIG. 32 illustrates a sixteenth alternative mode of the array imagingmodule, wherein the driver 30′ is an integrated driver. In other words,the optical lenses 10′ are coupled at one single driver 30′, whereinafter the driver 30′ is installed at molded base 23′, the optical lenses10′ are located along the photosensitive paths of the photosensitiveunits 21′. Through the integrated driver of the present invention, theefficiency of the assembling process of the array imaging module can beincreased, the size of the array imaging module can be further reduced,and structure of the array imaging module can be more compact. As aresult, the array imaging module of the present invention is suitablefor the thinness and lightness of the electronic device.

It is worth mentioning that after the molded base 23′ and the circuitboard 22′ are integrally formed together, the molded base 23′ willreinforce the strength of the circuit board 22′. In other words, themolded base 23′ forms a reinforcing portion 28′ of the circuit board22′, wherein the electronic elements 26′ are enclosed within thereinforcing portion 28′. Therefore, the reinforcing portion 28′ not onlyencloses all the electronic elements 26′ to prevent the electronicelements 26′ from exposing and contacting with air outside, but alsoisolate the electronic elements 26′ with each other to prevent themutual interference by the adjacent electronic elements 26′. On theother hand, the electronic elements 26′ will ensure the engagementbetween the reinforcing portion 28′ and the circuit board 22′ so as toprevent the circuit board 22′ being detached from the reinforcingportion 28′. As a result, the assembly of the array imaging module willensure the reliability and stability of the array imaging module duringthe operation thereof.

FIG. 34 illustrates a seventeenth alternative mode of the array imagingmodule, wherein the circuit board 22′ has at least a reinforcing cavity229′, wherein once the reinforcing portion 28′ is formed, at least aportion of the reinforcing portion 28′ is extended into the reinforcingcavity 229′, such that the reinforcing portion 28′ can be securelycoupled to the circuit board 22′. It is worth mentioning that thereinforcing cavity 229′ can be a through slot or a non-through slot.FIG. 34 shows the reinforcing cavity 229′ is a, but not limit to,through slot. It is appreciated that the reinforcing cavity 229′ can bea non-through slot.

FIG. 35 illustrates an eighteenth alternative mode of the array imagingmodule, wherein the molded photosensitive assembly 20′ further comprisesa base frame 29′, such as a base panel, overlapped with and coupled atthe circuit board 22′, such that the base frame 29′ will reinforce thestrength of the circuit board 22′ so as to retain the flatness of thecircuit board 22′. It is appreciated that the thickness of the circuitboard 22′ can be reduced via the base frame 29′ to reduce the thicknessof the array imaging module, so as to further reduce the thinness andlightness of the electronic device.

Preferably, the base frame 29′ can be made of metal or other alloys. Forexample, the base frame 29′ can be made of aluminum, such that the baseframe 29′ not only ensures the flatness of the circuit board 22′ butalso enhance the heat dissipation of the circuit board 22′. Therefore,the base frame 29′ can prevent the overheat of the array imaging moduleso as to enhance the reliability of the array imaging module during theoperation thereof.

Furthermore, the base frame 29′ has at least a second reinforcing cavity291′, wherein after the base frame 29′ is overlapped with and coupled tothe circuit board 22′, the first reinforcing cavity 229′ of the circuitboard 22′ and the second reinforcing cavity 291′ of the base frame 29′are correspondingly aligned with each other. Therefore, the moldmaterial can pass through the first reinforcing cavity 229′ and thesecond reinforcing cavity 291′. Once the mold material is solidified,the circuit board 22′, the base frame 29′ and the reinforcing portion28′ are integrally combined with each other. It is appreciated that thesecond reinforcing cavity 291′ can be a through hole or a non-throughhole.

FIG. 36 illustrates a nineteenth alternative mode of the array imagingmodule, wherein the base frame 29′ further comprises a main base body292′ and at least two conductive bodies 293′. The two conductive bodies293′ are spacedly and integrally extended from the main base body 292′.The circuit board 22′ further has at least two channels 300′, whereinwhen the photosensitive units 21′ are coupled at the circuit board 22′,the channels 300′ are correspondingly aligned with the photosensitiveunits 21′ respectively. The circuit board 22′ is overlappedly coupled atthe main base body 292′, wherein the two conductive bodies 293′ areengaged with the channels 300′ respectively, such that thephotosensitive units 21′ are electrically contacted with the conductivebodies 293′ respectively. As a result, the conductive bodies 293′ andthe main base body 292′ will effectively dissipate the heat generated bythe photosensitive units 21′ so as to enhance the heat dissipating powerof the array imaging module.

FIG. 37 illustrates a twentieth alternative mode of the array imagingmodule, wherein the photosensitive unit 21′ is not coupled at thecircuit board 22′ but is coupled at the channel 300′ of the conductivebody 293′ formed at the circuit board 22′. In other words, thephotosensitive unit 21′ is coupled at the conductive body 293′ and iselectrically linked to the circuit board 22′. In this configuration, theflatness of the photosensitive unit 21′ does not have to be retained bythe circuit board 22′, such that the rigidity of the circuit board 22′can be reduced to minimize the thickness of the array imaging module.Therefore, the circuit board 22′ can be a flexible circuit board tominimize the overall height of the array imaging module.

FIG. 38 illustrates a twentieth-first alternative mode of the arrayimaging module, which comprises at least two optical lenses 10′, amolded photosensitive assembly 20′, and at least an additionalphotosensitive unit 21″. Each of the additional photosensitive units 21″is operatively coupled at the circuit board 22′ of the moldedphotosensitive assembly 20′, wherein the optical lenses 10′ are locatedalong the optical paths of the photosensitive unit 21′ of moldedphotosensitive assembly 20′ and the additional photosensitive unit 21″respectively, so as to form the array imaging module. In addition, thearray imaging module further comprises at least an additional supporter270″, at least an additional driver 30″, and/or at least an additionallens barrel 60″. The additional supporters 270″ are electrically coupledat the circuit board 22′ of the molded photosensitive assembly 20′. Theadditional drivers 30″ and/or the lens barrels 60″ are installed at thecircuit board 22′. The optical lenses 10′ are operatively installed atone of the drivers 30′, the lens barrels 60″, the additional drivers30″, and the additional lens barrels 60″. Then, the optical lenses 10′are located along the photosensitive paths of the photosensitive unit21′ of molded photosensitive assembly 20′ and the additionalphotosensitive unit 21″ respectively. In addition, the additionalphotosensitive unit 21″ is not coupled at the circuit board 22′ of themolded photosensitive assembly 20′ but is installed at an additionalcircuit board 22″ of the array imaging module.

FIG. 39 is a block diagram of the electronic components of the arrayimaging module according to the preferred embodiment of the presentinvention. The present invention provides an electronic device built-inwith the array imaging module. The electronic device comprises a devicebody 200 with a device processor therein, wherein the array imagingmodule is mounted at the device body 200 to operatively link to thedevice processor therein for capturing image. It is worth mentioningthat the location of the array imaging module with respect to the devicebody 200 should not limited. As shown in FIGS. 40A and 40B, the arrayimaging module can be located at one of the upper corners of the devicebody 200 along the transverse direction thereof. As shown in FIG. 40C,the array imaging module can be located at the mid-portion of the devicebody 200 along the longitudinal direction thereof.

One skilled in the art will understand that the embodiment of thepresent invention as shown in the drawings and described above isexemplary only and not intended to be limiting.

It will thus be seen that the objects of the present invention have beenfully and effectively accomplished. The embodiments have been shown anddescribed for the purposes of illustrating the functional and structuralprinciples of the present invention and is subject to change withoutdeparture from such principles. Therefore, this invention includes allmodifications encompassed within the spirit and scope of the followingclaims.

What is claimed is:
 1. An array imaging module, comprising: at least twooptical lenses; and a molded photosensitive assembly, which comprises:at least two photosensitive units; a circuit board, wherein saidphotosensitive units are electrically coupled at said circuit board; atleast one electronic element electrically coupled at and protruded fromsaid circuit board; and a molded base having at least two opticalwindows, wherein said molded base is molded to integrally couple at saidcircuit board at a peripheral portion thereof to form an integratedstructure, wherein said at least one electronic element is molded to besealed and enclosed within said molded base for preventing an exposureof said at least one electronic element, wherein said photosensitiveunits are aligned with said optical windows respectively, wherein saidoptical lenses are located along two photosensitive paths of saidphotosensitive units respectively, such that each of said opticalwindows forms a light channel through said corresponding photosensitiveunit and said corresponding optical lens.
 2. The array imaging module,as recited in claim 1, wherein said molded photosensitive assemblyfurther comprises at least one lead wire, wherein said at least one leadwire has two ends electrically connected to a chip connector of saidphotosensitive unit and said circuit board respectively so as toelectrically connect said photosensitive unit with said circuit board,wherein at least one of said at least one lead wire is integrally moldedto be sealed and enclosed within said molded base.
 3. The array imagingmodule, as recited in claim 2, wherein one of said photosensitive unitshas a larger photosensitive area while another said photosensitive unithas a smaller photosensitive area, wherein said circuit board has atleast a receiving chamber, wherein said photosensitive unit having asmaller photosensitive area is received in said receiving chamber whilesaid photosensitive unit having a larger photosensitive area is coupledat a surface of said circuit board.
 4. The array imaging module, asrecited in claim 1, wherein said molded base further comprises a baseframe integrally molded to be overlapped with and coupled at a bottomside of said circuit board, such that said base frame reinforces astrength of said circuit board so as to retain a flatness of saidcircuit board.
 5. The array imaging module, as recited in claim 4,wherein said base frame has at least a second reinforcing cavity,wherein after said base frame is integrally molded to be overlapped withand coupled to said circuit board, said first reinforcing cavity of saidcircuit board and said second reinforcing cavity of said base frame arecorrespondingly aligned with each other, wherein at least a portion ofsaid molded base is extended into said first and second reinforcingcavities to integrally couple said circuit board, said molded base, andsaid base frame with each other.
 6. The array imaging module, as recitedin claim 5, wherein said base frame further comprises a main base bodyand at least two conductive bodies which are spacedly and integrallyextended from said main base body, wherein said circuit board furtherhas at least two channels, wherein said circuit board is integrallymolded to be overlappedly coupled at said main base body and said twoconductive bodies are engaged with said channels respectively, such thatsaid photosensitive units are electrically contacted with saidconductive bodies respectively.
 7. The array imaging module, as recitedin claim 6, wherein said circuit board has at least a receiving chamber,wherein at least one of said photosensitive units is received in saidreceiving chamber of said circuit board, wherein said receiving chamberis configured as one of a receiving slot and a through slot.
 8. Thearray imaging module, as recited in claim 4, wherein said base framefurther comprises a main base body and at least two conductive bodieswhich are spacedly and integrally extended from said main base body,wherein said circuit board further has at least two channels, whereinsaid circuit board is integrally molded to be overlappedly coupled atsaid main base body and said two conductive bodies are engaged with saidchannels respectively, such that said photosensitive units areelectrically contacted with said conductive bodies respectively.
 9. Thearray imaging module, as recited in claim 1, wherein said circuit boardhas at least a first reinforcing cavity, wherein once said molded baseis formed by molding, at least a portion of said molded base is extendedinto said first reinforcing cavity to integrally couple said circuitboard and said molded base with each other.
 10. The array imagingmodule, as recited in claim 1, wherein said base frame has at least asecond reinforcing cavity, wherein after said base frame is integrallymolded to be overlapped with and coupled to said circuit board, saidfirst reinforcing cavity of said circuit board and said secondreinforcing cavity of said base frame are correspondingly aligned witheach other, wherein at least a portion of said molded base is extendedinto said first and second reinforcing cavities to integrally couplesaid circuit board, said molded base, and said base frame with eachother.
 11. The array imaging module, as recited in claim 1, wherein saidbase frame further comprises a main base body and at least twoconductive bodies which are spacedly and integrally extended from saidmain base body, wherein said circuit board further has at least twochannels, wherein said circuit board is integrally molded to beoverlappedly coupled at said main base body and said two conductivebodies are engaged with said channels respectively, such that saidphotosensitive units are electrically contacted with said conductivebodies respectively.
 12. The array imaging module, as recited in claim1, wherein said circuit board has at least a receiving chamber, whereinat least one of said photosensitive units is received in said receivingchamber of said circuit board.
 13. The array imaging module, as recitedin claim 12, wherein said receiving chamber is configured as one of areceiving slot and a through slot.
 14. The array imaging module, asrecited in claim 1, wherein one of said photosensitive units has alarger photosensitive area while another said photosensitive unit has asmaller photosensitive area, wherein said circuit board has at least areceiving chamber, wherein said photosensitive unit having a smallerphotosensitive area is received in said receiving chamber while saidphotosensitive unit having a larger photosensitive area is coupled at asurface of said circuit board.
 15. The array imaging module, as recitedin claim 1, further comprising at least a light filter located betweeneach of said photosensitive unit and said optical lens.
 16. The arrayimaging module, as recited in claim 15, wherein said light filter iscoupled at a top side of said molded base to retain said light filter inposition between each of said photosensitive units and said opticallens.
 17. The array imaging module, as recited in claim 16, wherein saidlight filter is coupled at a lens casing of said optical lens to retainsaid light filter in position between each of said photosensitive unitsand said optical lens.
 18. The array imaging module, as recited in claim16 wherein said molded base has at least an indented groove formed atsaid top side thereof corresponding to said optical window, wherein saidlight filter is engaged with said indented groove.
 19. The array imagingmodule, as recited in claim 15, further comprising an encircling frameshaped supporter coupled at a top side of said molded base, wherein saidlight filter is coupled at said supporter to retain said light filter inposition between said photosensitive unit and said optical lens.
 20. Thearray imaging module, as recited in claim 19, wherein said molded basehas at least an indented groove formed at a surface thereofcorresponding to said optical window, wherein said supporter is engagedwith said indented groove.